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TriQuint Semiconductor Inc. announced that it has been selected by the Defense Advanced Research Projects Agency (DARPA) to lead a $12.3 million development program focused on ultra-fast gallium nitride (GaN) switch technology for the Microscale Power Conversion (MPC) program. TriQuint’s revolutionary new GaN modulator has the potential to enable highly-efficient RF transmitters substantially smaller than current solutions.
Skyworks introduces a high power shunt PIN diode for transmit and receive switching applications. The SMP1304-085LF is a discrete solution in a very low thermal resistance package that combines very low insertion loss, good isolation, excellent power handling (40W C/W), and low distortion.
TE Connectivity's Aerospace, Defense & Marine business announces its new community-centered website for design engineers, www.DesignSmarterFaster.com. The new site is meant to be a resource center for design engineers to connect directly with TE Subject Matter Experts (SMEs) who can advise and team up with them early in the design process to help bring their products and systems to market faster with smarter, better solutions.
Cobham has been awarded a $39 M contract from the U.S. Naval Air Systems Command to manufacture the AN/ALQ-99 Low Band Transmitter-Antenna Group for U.S. Navy and Marine Corps EA-6B and EA-18G EW aircraft.
Researchers at Chalmers University of Technology, Sweden, have developed a new generation of amplifiers that has the ability to measure data that is currently buried by noise.
Carlisle Interconnect Technologies announced today that it’s interconnect division located in El Segundo, CA has been named a recipient of the 2011 Boeing Performance Excellence Award (BPEA) for a third consecutive year, 2009, 2010, and 2011 based on its superior supplier performance.
Auriga Microwave announces the addition of Dr. Joseph R. Guerci to the company's Department of Defense (DoD) Industry Advisory Board.
Nitronex has been awarded a Phase I SBIR to develop a highly efficient 20W X-band GaN power amplifier MMIC for use in long range RF telecommunications. Since 2005, Nitronex has won 16 government contract awards that have funded the development of materials, devices, discretes, MMICs, and process technologies, as well as manufacturing maturation.
At CTIA 2012, W. L. Gore & Associates will showcase the next generation of its screw-in GORE® Protective Vents. The rugged, single-body construction of this vent increases protection against mechanical stress in harsh environments often encountered by telecommunication equipment. For additional reliability, all of these vents are now online quality-tested and laser-marked with unique identification numbers to enable individual product tracking.
Remtec Inc. has added a new universal finish of Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) as a standard finish to its umbrella of fabrication methods. The new finish resolves a problem of intermetalics detrimental to the reliability of solder joints (black pad formations) and wire bonding connections.
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