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AWR® , Transim Technology and NXP Semiconductors announced the launch of the NXP SimPort Design Center for the online design exploration of NXP’s small signal RF transistors. The SimPort Design Center provides a variety of online design solutions across NXP’s product portfolio and now features an “interactive datasheet” for...

Microsemi Corp. , a manufacturer of high performance analog mixed signal integrated circuits and high reliability semiconductors, has announced a new high efficiency, high power Insulated Gate Bipolar Transistor (IGBT) based on its latest MOS 8™ technology platform. The new IGBT has been optimized for lower frequency operation (10...

RF Micro Devices Inc. (RFMD) announced the company has added high power Integrated Passive Component (IPC) technology to RFMD's foundry services portfolio and will begin providing IPC technology to customers of its Foundry Services business unit in June of this year. RFMD's IPC technology is complementary to its GaN...

Maury Microwave Corp. announced the introduction of an entirely new line of instrument-grade precision components designed to provide users with the right level of performance at the right price. This new product line, TactiCal™ by Maury, includes calibration standards manufactured to the same high quality and exacting requirements that...

Gowanda Electronics , a manufacturer of high performance inductors and other precision electronic components for RF and power applications, will be featuring a new surface-mount inductor series – SMP1210S – at the International Microwave Symposium in Anaheim, CA (Booth #1538). The SMP1210S series combines high current, shielding and small...

RF Micro Devices Inc. (RFMD) announced the successful qualification of the company's second high-power Gallium Nitride (GaN) process technology, expanding the company’s industry-leading portfolio of compound semiconductor technologies. RFMD’s second high-power GaN HEMT process technology (GaN2) achieves 1 to 2 dB higher gain and 6 dB greater linearity than...

RF Micro Devices Inc. (RFMD) announced the company will showcase its broad portfolio of industry-leading RF communications components at the IEEE International Microwave Symposium (IMS), to be held May 25-27, 2010, in Anaheim, CA. During the conference, RFMD will host in-booth demonstrations of the company’s high-power gallium nitride (GaN)...

Agilent Technologies Inc. announced Genesys 2010, a new release of its industry-leading, low cost, high-performance RF/microwave design software. The software, used by circuit board and subsystem designers, now includes breakthrough nonlinear X-parameter simulation and modeling technology. This enables the most accurate and convenient RF nonlinear circuit and system designs....

Tektronix and its partners will be showcasing new solutions ranging from components, instruments and systems at Booth 1033 during the IMS 2010 show. The integration of digital and analog RF is presenting engineers with a highly complex environment, necessitating a new generation of RF/microwave test tools. The solutions offered...

Passive Plus Inc. currently offers a line of ultra high power capacitors available in two case sizes for UHF/microwave transmitter applications: 6040 P/C series: size: .600”x.400”; Q: >10,000; WVDC: 5000 V; extended WVDC: 10,000 V; TC: 0 +/- 30 PPM/°C (NPO). 7676 P/C series: size: .760” x .760”; Q:...