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Effects of Single-tone Spurious Responses on Signals in ESM Receivers

This article presents the effects of spurious responses in ESM receivers used to geo-locate threat emitters. These spurs contaminate the measured values of phase and frequency of detected signals in the receivers, beyond the effect of receiver noise, c...
October 9, 2010
S.J. Caprio, Laurel, MD
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Electronic Support Measures (ESM) receivers geo-locate threat emitters by measurement of angle of arrival (AOA), time difference of arrival (TDOA) or frequency difference of arrival (FDOA). Errors in the measurement of phase and frequency may be contaminated, due to spurious responses that yield irresolvable errors. Phase Contamination Radar signals...
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Side Lobe Suppression of Printed Antenna Arrays for Integration with Microwave Circuits

Various factors that limit high side lobe suppression (SLS) in printed antenna arrays (PAA) have been analyzed in this article. A new type of linear printed antenna array, with pentagonal dipoles as radiating elements operating at a second resonance en...
October 9, 2010
A. Nešić, I. Radnovicć, Z. Mićić and S. Jovanović, IMTEL Institute, Belgrade, Serbia
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Microwave printed antenna arrays (PAA) have various advantages over conventional antenna systems, due to their low cost, great reproducibility and the possibility of integration with other microwave circuits. Because of this, they are often used in telecommunication systems, such as indoor and outdoor wireless LANs, point-to-point and point-to-multipoint, and...
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Direct Plated Copper Metallized Substrate and Its Application on Microwave Circuits

A direct plated copper (DPC) metallized substrate technique is introduced and characterized in this article. The proposed DPC metallized substrate provides the main advantages of excellent thermal management and high-frequency characteristics, due to t...
October 9, 2010
Chien-Cheng Wei, Chin-Ta Fan, Ta-Hsiang Chiang, Ming-Kuen Chiu and Shao-Pin Ru, Tong Hsing Electronic Industries Ltd.Taipei Hsien, Taiwan
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The direct plated copper (DPC) process on metallized ceramic substrate was originally created to replace the direct bonded copper (DBC) process because of its better electrical, thermal and mechanical performance. 1 Compared to DBC, DPC provides a very strong bond strength between the Al2O3/AlN substrate and the copper metal,...
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Lockheed Martin Receives $106 M Contract

October 8, 2010
Lockheed Martin
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Lockheed Martin announced that it has received a $106 M engineering, manufacturing and development contract from Northrop Grumman Corp. to develop the next-generation Reentry Field Support Equipment (RFSE) for the US Air Force’s Minuteman III Intercontinental Ballistic Missile (ICBM) system. Under the 58-month contract awarded in July, Lockheed Martin...
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