Amphenol RF is pleased to introduce its new PSMP interface as the perfect solution for board-to-board applications. With a minimum board spacing of 12.6 mm, the compact three-piece design allows maximum flexibility for high-density board spacing, and is an ideal solution for blind-mating situations.
The Peraso W110 chipset is targeted for WiGig® applications and includes the PRS1125 direct conversion 60 GHz RFIC and the PRS4001 baseband IC to implement the necessary functionality in the next generation IEEE 802.11ad standard for Wi-Fi networks. Incorporating a USB 3.0 system interface, the W110 chipset is ideally suited for adapters and peripherals which are expected to play a vital role as the WiGig® ecosystem continues to develop in 2016.
Altair Semiconductor, a leading provider of LTE chipsets, announced the opening of a research and development (R&D) center in Taiwan to support the company’s technical advancement in the major Asian growth-center.
TowerJazz, the global specialty foundry leader, announced that TowerJazz Panasonic Semiconductor Co. (TPSCo), working with Keysight Technologies, has developed an Advanced Design System (ADS) interoperable PDK (process design kit), as well as a calibrated Momentum module deck on TPSCo's advanced 65nm RF CMOS platform to allow mutual customers to improve design efficiency and realize first time to market.
The U.S. Army is fielding upgrades for its at-the-halt tactical communications network, Warfighter Information Network-Tactical Increment 1, or WIN-T Inc 1, which will increase readiness, security and capability while reducing equipment by a third for a more powerful and expeditionary current and future force.
Mitsubishi Electric Corp. announced that it would expand its lineup of gallium nitride high electron mobility transistors (GaN-HEMTs) for use in base transceiver stations (BTS) operating in the 3.5 GHz Band of fourth generation (4G) mobile communication systems. The four new GaN-HEMTs offer output power and efficiency levels that are among the highest currently available according to company research as of December 22. Samples will be released starting February 1.
Ericsson and Apple have agreed on a global patent license agreement between the two companies. The agreement includes a cross license that covers patents relating to both companies' standard-essential patents (including the GSM, UMTS and LTE cellular standards), and grants certain other patent rights. In addition, the agreement includes releases that resolve all pending patent-infringement litigation between the companies.