Industry News

Sirenza Awarded Patent on Dynamic Feedback Linearization

Sirenza Microdevices announced it has been awarded US patent no. 7,218,175 entitled “Dynamic Feedback Linearization.” This new US patent discloses a means for improving linearity and efficiency for a wide breadth of amplifier applications. “This patent is directly applicable to our core amplifier product lines,” said Kevin Kobayashi, executive...
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Teamwork for BAE Systems, QinetiQ and Roke

The <B>BAE Systems</B> and </B>QinetiQ</B> partnership bidding to supply a new Naval Medium Range Radar (NMRR) system for the Royal Navy’s Type 23 frigates and aircraft carriers has been further strengthened through a teaming agreement with research an...
The BAE Systems and QinetiQ partnership bidding to supply a new Naval Medium Range Radar (NMRR) system for the Royal Navy’s Type 23 frigates and aircraft carriers has been further strengthened through a teaming agreement with research and development specialist, Roke Manor Research Ltd. The team’s offering, ARTISAN 3D,...
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Farran Re-tools for the Future

Since <B>Farran Technology</B> was acquired by the Smiths Group there have been many positive changes.
Since Farran Technology was acquired by the Smiths Group there have been many positive changes. Farran has now been aligned with other similarly branded businesses, focused on markets within the Microwave Systems section of the Interconnect division, under the umbrella of the Specialty Engineering Group. With these changes in...
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B&Z Technologies Introduces Next Generation Amplifiers

<B>B&Z Technologies</B>, established in 2001, introduces next generation amplifiers. The BZ series offers the widest bandwidth and the lowest noise figures in the industry.
B&Z Technologies , established in 2001, introduces next generation amplifiers. The BZ series offers the widest bandwidth and the lowest noise figures in the industry. Remarkably, the amplifiers fit into one standard housing. Within the 30 kHz to 70 GHz range, customized power, gain and noise figure combinations are...
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Eagle Comtronics to Present Four New Products

<B>Eagle Comtronics</B> is pleased to present four new products at this year’s IEEE MTT-S show. The product represents a portion of the product range presently offered by Eagle.
Eagle Comtronics is pleased to present four new products at this year’s IEEE MTT-S show. The product represents a portion of the product range presently offered by Eagle. SBLP Series – Switched Filter Assembly Filters Eagle Comtronics is extending its support of SONET/SDH customers by offering model SBLP-2-SP-SF/SF-X five...
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Jazz Semiconductor Announces Release of 130nm SiGe BiCMOS Technology

<B>Jazz Semiconductor</B> announces the release of a new 130nm SiGe BiCMOS technology designed for high speed wireless and optical communications applications.
Jazz Semiconductor announces the release of a new 130nm SiGe BiCMOS technology designed for high speed wireless and optical communications applications. This process combines industry standard 130nm CMOS with 200 GHz HBT NPN transistors for high performance RF and millimeter-wave integrated circuits. The technology offering includes advanced analog components...
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P1dB Announces New Right Angle SMA RF Coaxial Cables

<B>P1dB</B> announces YouForm™ high quality, low cost jacketed hand formable cables that feature stainless steel SMA plugs on each end and are now available in straight and right angle configurations.
P1dB announces YouForm™ high quality, low cost jacketed hand formable cables that feature stainless steel SMA plugs on each end and are now available in straight and right angle configurations. 100 percent VSWR tested 1.35:1 at 18 GHz for SMA straight connectors and 1.35:1 at 10 GHz for SMA...
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Quantum Leap Announces Breakthrough in Plastic Hermetic Packaging

<B>Quantum Leap Packaging Inc.</B> (QLP), a provider of high performance, air cavity packages for semiconductor assembly, has announced the availability of HermeTech™, the industry's first hermetic plastic package that meets JEDEC standards.
Quantum Leap Packaging Inc. (QLP), a provider of high performance, air cavity packages for semiconductor assembly, has announced the availability of HermeTech™, the industry's first hermetic plastic package that meets JEDEC standards. QLP is manufacturing HermeTech plastic air cavity QFNs that maintain hermetic leak rates of less than 5x10-8...
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