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Industry News

Design Considerations for Thick-film High Power Chip Terminations

Three strongly interrelated aspects of thick-film termination design: materials and processes, thermal management and RF impedance matching
TECHNICAL FEATURES Design Considerations for Thick-film High Power Chip Terminations Robert Grossbach American Technical Ceramics Huntington Station, NY A s the wireless revolution extends component requirements upward in frequency, higher in operating power and smaller in size, the performance demands on surface-mount devices grow ever more stringent. Chip terminations...
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The ABCs of Device Biasing

An overview of the basics of device biasing and the most common modes of amplifier operation
TUTORIALS The ABCs of Device Biasing Brian Battaglia Motorola, Wireless Infrastructure Systems Division Tempe, AZ T his tutorial article covers the most common modes of amplifier operation. Each mode of operation has distinct characteristics associated with it and, therefore, the modes are delineated into individual classes. Each class has...
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Shielding Formulas for Near Fields

Extremely low frequency formulas for magnetic shielding effectiveness
TECHNICAL NOTES Shielding Formulas for Near Fields R.C. Hansen Consulting Engineer Tarzana, CA This article reviews extremely low frequency (ELF) formulas for magnetic shielding effectiveness. In particular, the simple three-term Schelkunoff formula is accurate at all frequencies if the proper near-field, or far-field, wave impedance is used. E lectromagnetic...
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NEW PRODUCTS

NEW PRODUCTS COMPONENTS *           Power Splitters The models PD22-73 power divider and HY22-73 90° hybrid are designed for the 2.1 to 2.3 GHz ISM band. The 50 W components offer low loss, high isolation and good phase/amplitude balance. The monolithic circuitry is 100 percent passive and available in...
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AROUND THE CIRCUIT

AROUND THE CIRCUIT INDUSTRY NEWS *          Spacek Labs Inc. , Santa Barbara, CA, has completed its acquisition of the assets of millimeter-wave amplifier manufacturer Sierra Wireless Systems . Financial terms of the cash agreement were not disclosed. *          Gel-Pak , ® Sunnyvale, CA, has acquired Silicon Packaging Technology Inc....
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New Literature

NEW LITERATURE *          Product Brochure This six-page brochure describes integrated assemblies, converter assemblies, log components, log IFs, components, filter banks and switch filter banks. Product photographs are provided. Descriptions of the company's manufacturing and engineering processes are included, as well as a company mission statement. AKON, San Jose, CA...
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News From Washington

NEWS FROM WASHINGTON THAAD System Development Contract Awarded Raytheon Co. has been awarded a contract from Lockheed Martin Co. to design, develop and manufacture three Engineering and Manufacturing Development radars for the Theater High Altitude Area Defense (THAAD) system. The award is valued in excess of $1.4 B and...
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International

INTERNATIONAL REPORT Martin Streetly, International Correspondent EADS Wins US Radar Contract T he European Aeronautic, Defence and Space (EADS) Co.'s Ulm, Germany-based Airborne Systems unit has been awarded a US$11.9 M contract by the US Navy (USN) that covers the supply of components for its AN/APG-65 radar programme. EADS'...
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Commercial Market

THE COMMERCIAL MARKET New Consortium Aims to Make TV More Personal and Interactive Microsoft Corp., DIRECTV Inc. and THOMSON multimedia have announced an alliance to bring a new advanced RCA ® DIRECTV™ system with the new Microsoft ® Ultimate TV™ service to market. The RCA DS4290RE system with Ultimate...
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THE BOOK END

THE BOOK END * Handbook of CDMA System Design, Engineering and Optimization Kyoung Il Kim Prentice Hall PTR 252 pages plus CD ROM; $80 ISBN: 0-13-017572-2 Code division multiple access (CDMA) has become a preferred choice of the wireless telecommunications industry. This book is the result of recent efforts...
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