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Industry News

An RF Component Analyzer for Measuring Multi-function RF Modules

Communications services such as mobile phone and wireless LAN have increased the use of multi-bands while the terminals are becoming smaller. These trends have led to the widespread use of RF modules combining multiple functions. Along with this trend is the ability to make increasingly complex measurements more efficient....
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Low Profile, High Performance Surface Mount Couplers

A new family of low profile, high performance couplers has been introduced in a new easy-to-use, manufacturing friendly surface-mount package. These new couplers feature lower insertion loss, better phase balance, less amplitude imbalance, and higher isolation and directivity than previous offerings in this area. The new parts are much...
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Thermally Stable PCB Material

A new printed circuit board material has been developed to meet the demanding requirements for dielectric constant temperature stability and plated hole reliability for high temperature and varying environmental conditions. TSM-30 is based on a high temperature, low loss organic combined with ceramic. The material exhibits superior low loss,...
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A Magnetic MEMS-based RF Relay

Micro-electromechanical systems (MEMS)-based products run from the mundane of automobile air-bag sensors to the over-hyped optical switching fabrics of the recent telecommunications bubble. For some time now, design engineers have been waiting for the advantages of MEMS fabrication techniques to be successfully applied to the problem of RF and...
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From Design to Reality

Development speed is a major concern in today's products' life cycle. Ranking alongside the raw costs involved with prototyping a device, time-to-market is the one key constraint imposed on design engineers. Consequently, any innovative or competitive advantage can easily be lost if advanced ideas get stuck in a long...
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Design of a 900/1800 MHz Dual-band LTCC Chip Antenna for Mobile Communications Applications

This article presents the design simulation, implementation and measurement of a miniaturized 900/1800 MHz dual-band low temperature co-fired ceramic (LTCC) chip antenna for mobile communication applications. The use of a helix-monopole type dual-band ...
Recently, multi-layer LTCC technology has been used extensively for the miniaturization of RF passive components and antennas. In addition to the high integration by embedding components and interconnects, high Q passive elements have been demonstrated with LTCC technology. 1 It is suitable to integrate antennas and other passive components,...
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A K- and Ka-band Vehicular Phased-array Antenna

Commercial applications of phased-array antennas have been extensively studied over the last decade, principally in the case of vehicular antennas. Beside the problems related with the design of such an array, there are some general considerations that must be taken into account. If the vehicular antenna has a high...
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