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Industry News

Multilayer Prototype and Series Production

A look at multilayer circuit boards, their manufacturing processes and how multilayer prototypes can be quickly fabricated in the lab
Klaus-Dietmar Muller
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TUTORIAL MULTILAYER PROTOTYPE AND SERIES PRODUCTION KLAUS-DIETMAR MULLER LPKF Laser & Electronics AG Garbsen, Germany Multilayers, or multilayer PCBs, are circuit boards made up of several (more than two) electrical layers (copper layers) superimposed on one another. The copper layers are bonded together by resin layers (prepreg). WHAT MANUFACTURING...
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Testing Digital Communications Transmitters and Receivers

Test methods for today's more spectrally efficient communications hardware
Helen Wright
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TUTORIAL TESTING DIGITAL COMMUNICATIONS TRANSMITTERS AND RECEIVERS HELEN WRIGHT Agilent Technologies Liberty Lake, WA There is a fundamental tradeoff in communication systems. Simple hardware can be used in transmitters and receivers to communicate information. However, this method uses a lot of spectrum, which limits the number of users. Alternatively,...
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New Products

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AMPLIFIERS 750 W, Ku-band TWT Amplifier The model VZU-6997AB is a 750 W, compact traveling-wave tube (TWT) amplifier that operates across the 12.75 to 14.5 GHz frequency range. It offers high reliability and efficiency in a compact package, and is ideal for transportable and fixed earth station applications where...
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Around the Circuit

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INDUSTRY NEWS SEMX Corp.'s wholly owned subsidiary Polese Co., San Diego, CA, recently acquired the technology and assets of Engelhard Corp.'s electroless gold plating business in Anaheim, CA. Operations will continue in this facility until July, when the business will be relocated to San Diego. Specific terms of the...
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New Literature

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NEW LITERATURE COMPANY NEWSLETTER This eight-page quarterly newsletter (Test & Measurement News) provides information about various products including lightwave, communication test, general purpose, RF and microwave, digital design and debug, and wireless test. It also includes Web site information as well as company news briefs and literature updates. Agilent...
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NEW PRODUCTS

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AMPLIFIERS 800 W C-band, Solid-state Power Amplifier The 800 W C-band, solid-state power amplifier and 3200 W phase-combined system are built for satellite communications. The single 10.5-inch-high rack design offers 800 W SSPA in C band, 600 W in X band and 250 W in Ku band. Phase-combined, multi-unit...
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Around the Circuit

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INDUSTRY NEWS Industry friend and colleague Thomas James Zinkowsky ("TZ") died April 30 in Santa Cruz, CA following a motorcycle accident. He was 35. For the past 18 years, TZ worked for Signal Technology Corporation, Danvers, MA, rising to the position of director of corporate sales and marketing in...
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NEW LITERATURE

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NEW LITERATURE PRODUCT CATALOG This 132-page catalog offers information and specifications on the company's full line of RF inductors, power inductors, EMI/RFI suppressors, transformers and other specialty products. Industry-standard, circuit solution and application-specific components are detailed as well as a number of new products. API Delevan Inc., East Aurora,...
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NEWS FROM WASHINGTON

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NEWS FROM WASHINGTON Recent decisions made at the US Air Force Electronic Systems Center, Hanscom Air Force Base, MA, and within the Department of Defense (DoD) have had positive effects on the DoD's overall effort to modernize its air traffic control (ATC) systems. The completion of the Electronic Systems...
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The Bookend

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THE BOOK END Flip Chip Technologies John H. Lau McGraw-Hill 565 pages; $89 ISBN: 0-07-036609-8 Of the three popular chip-level connection technologies, flip chip provides the highest packaging density and performance, and the lowest packaging profile. Unfortunately, it is also the least understood. This book deals with classical solder-bumped...
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