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Industry News

Extending Gold Thick-film Technology through Materials and Process Development

A combination of new gold powder technology and advanced manufacturing techniques that makes it possible to achieve fine-line resolutions of 3 mils (75 µm) through screen printing methods
Meg Tredinnick and David Malanga
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TECHNICAL FEATURES Extending Gold Thick-film Technology through Materials and Process Development Meg Tredinnick and David Malanga Heraeus Inc., Circuit Materials Division West Conshohocken, PA New powder and screen technologies have allowed for the development of a thick-film gold paste that meets a difficult list of requirements. This new Au...
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Time Domain Analysis of a Printed Circuit Board Via

Time domain analysis of a printed circuit board via connecting two semi-infinitely-long microstrip transmission lines above a ground plane
Brock J. LaMeres and T.S. Kalkur
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TECHNICAL FEATURES Time Domain Analysis of a Printed Circuit Board Via Brock J. LaMeres Agilent Technologies Colorado Springs, CO T.S. Kalkur University of Colorado, Department of Electrical and Computer Engineering Colorado Springs, CO This article describes the time domain analysis of a printed circuit board via connecting two semi-infinitely-long...
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Finite Element Analysis of RF Couplers With Sliced Coaxial Cable

Analysis of two coupled lines with sliced coaxial cable based on a numerical resolution of the Laplace's equation by the finite element method
N. Benahmed and M. Feham
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TECHNICAL FEATURES Finite Element Analysis of RF Couplers With Sliced Coaxial Cable N. Benahmed and M. Feham University of Tlemcen, Department of Electronic Tlemcen, Algeria This article presents the analysis of two coupled lines with sliced coaxial cable, based on a numerical resolution of the Laplace's equation by the...
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A Dynamic Drain Current Model for MESFET/HEMTs Valid Under Varying Static Bias and Temperature Conditions

Modifications to the Dortu-Muller DC drain current model for GaAs MESFET/HEMT devices that enable the dynamic output characterisitcs of the device to be simulated under different temperature and static bias conditions
J.M. Cairon, A. Tazon, T. Fernandez, C. Navarro, A. Mediavilla and J. Rodriguez-Tellez
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TECHNICAL FEATURES A Dynamic Drain Current Model for MESFET/HEMTs Valid Under Varying Static Bias and Temperature Conditions J.M. Cairon, A. Tazon, T. Fernandez, C. Navarro and A. Mediavilla University of Cantabria Cantabria, Spain J. Rodriguez-Tellez University of Bradford West Yorkshire, UK Modifications to the Dortu-Muller DC drain current model...
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Design Considerations for Thick-film High Power Chip Terminations

Three strongly interrelated aspects of thick-film termination design: materials and processes, thermal management and RF impedance matching
Robert Grossbach
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TECHNICAL FEATURES Design Considerations for Thick-film High Power Chip Terminations Robert Grossbach American Technical Ceramics Huntington Station, NY A s the wireless revolution extends component requirements upward in frequency, higher in operating power and smaller in size, the performance demands on surface-mount devices grow ever more stringent. Chip terminations...
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The ABCs of Device Biasing

An overview of the basics of device biasing and the most common modes of amplifier operation
Brian Battaglia
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TUTORIALS The ABCs of Device Biasing Brian Battaglia Motorola, Wireless Infrastructure Systems Division Tempe, AZ T his tutorial article covers the most common modes of amplifier operation. Each mode of operation has distinct characteristics associated with it and, therefore, the modes are delineated into individual classes. Each class has...
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Shielding Formulas for Near Fields

Extremely low frequency formulas for magnetic shielding effectiveness
R.C. Hansen
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TECHNICAL NOTES Shielding Formulas for Near Fields R.C. Hansen Consulting Engineer Tarzana, CA This article reviews extremely low frequency (ELF) formulas for magnetic shielding effectiveness. In particular, the simple three-term Schelkunoff formula is accurate at all frequencies if the proper near-field, or far-field, wave impedance is used. E lectromagnetic...
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NEW PRODUCTS

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NEW PRODUCTS COMPONENTS *           Power Splitters The models PD22-73 power divider and HY22-73 90° hybrid are designed for the 2.1 to 2.3 GHz ISM band. The 50 W components offer low loss, high isolation and good phase/amplitude balance. The monolithic circuitry is 100 percent passive and available in...
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AROUND THE CIRCUIT

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AROUND THE CIRCUIT INDUSTRY NEWS *          Spacek Labs Inc. , Santa Barbara, CA, has completed its acquisition of the assets of millimeter-wave amplifier manufacturer Sierra Wireless Systems . Financial terms of the cash agreement were not disclosed. *          Gel-Pak , ® Sunnyvale, CA, has acquired Silicon Packaging Technology Inc....
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New Literature

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NEW LITERATURE *          Product Brochure This six-page brochure describes integrated assemblies, converter assemblies, log components, log IFs, components, filter banks and switch filter banks. Product photographs are provided. Descriptions of the company's manufacturing and engineering processes are included, as well as a company mission statement. AKON, San Jose, CA...
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