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Industry News

A 2.4 GHz CMOS Transceiver Single-chip RF Front-end for ISM-band Wireless Communications

A 2.4 GHz CMOS transceiver single-chip RF front-end for ISM-band wireless communications is presented. The CMOS RFIC contains a gain-controlled low noise amplifier (LNA), a series-type T/R switch and a power amplifier (PA) with diode linearizers, which...
Due to the fast development of wireless communications, a low cost, high performance, highly integrated technology is needed for system-on-a-chip (SoC) implementations. The CMOS technology provides a good solution for SoC integration. 1 Recent improvements of the standard CMOS process make it possible to implement RF blocks, such as...
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UHF RFID and Tag Antenna Scattering, Part II: Theory

In Part II of this work, a numerical solution, using a reasonable estimate for the tag IC impedance, is shown to provide accurate estimates of the scattering effects of tag antennas. A greatly simplified scattering theory for tag arrays is also present...
In Part I of this article, 1 a number of experimental results were presented, suggesting that interactions in arrays of tag antennas play an important role in determining when a UHF RFID tag can be read, even when no other scattering is present in the environment. How can these...
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Web Update

RF Amplifier Systems and Modules This redesigned web site features a new search tool that allows users to search by keyword, power, power option and/or frequency. AR Worldwide Modular RF manufactures RF amplifier systems and modules for wireless communications, military communications, and a variety of medical, scientific and industrial...
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New Products

New Waves: Semiconductors/ MMICs/ RFICs
RF Power MOSFET The model ARF475FL is a high voltage, flangeless packaged, RF power MOSFET that utilizes a newly-patented process and finer geometry to deliver high peak power and RF gain. These MOSFETs operate reliably at DC voltages up to 165 V. The ARF475FL utilizes two die, configured for...
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Literature Showcase

Capabilities Brochure This brochure highlights the company’s design, development and manufacture of custom microwave hybrid circuits on ceramic, quartz, AlN, BeO, ferrite and glass. The hybrid circuits encompass resistor and conductor layers, plated-through holes, solid filled vias, multilayer circuits, air bridges and snapstrates. Bandwidth Semiconductor LLC, Hudson, NH (603)...
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The Book End

Microwave Devices, Circuits and Subsystems for Communications Engineering A. Glover, S.R. Pennock and P.R. Shepherd, Editors John Wiley & Sons Ltd. • 549 pages; $119.95 This book originated from a master’s degree course in RF communications engineering offered by the University of Bradford, UK. As such, it reads like...
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ADC and Andrew to Merge

ADC and Andrew Corp. announced that they have entered into a definitive merger agreement to create a global leader in wireline and wireless network infrastructure solutions. The transaction, which was approved by the boards of directors of both companies, will build upon the complementary strengths of each company to...
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