Industry News

Tower Wins Fab2 Deal with Top-tier US IDM

Tower Semiconductor Ltd. , a pure-play independent specialty foundry, announced that it has won a multi-million dollar per month manufacturing deal for its Fab2 at the 0.13-micron technology generation from a first-tier, US integrated device manufacturer (IDM). Under this deal, technology will be transferred during the coming several quarters...
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Remcom Announces Availability of XStream V 3.0

Utilizing the ability of the Graphics Processing Unit (GPU) in modern computer graphics cards to stream floating point calculations, Remcom ’s XFdtd full wave 3D EM solver achieves extremely fast calculation speeds via the XStream® Hardware FDTD option. The new Version 3.0 of XStream Hardware FDTD is now based...
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PULLNANO Consortium Reports Breakthrough

PULLNANO, a project sponsored by the European Commission within the 6 th Framework Program (FP6), has reported several important results related to the future-generation 32 nm and 22 nm CMOS technology platforms, including the realization of a functional CMOS Static Random Access Memory (SRAM) demonstrator built using 32 nm...
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ST and Nokia Expand 3G Collaboration

Nokia and STMicroelectronics have announced their intention to deepen their collaboration on the licensing and supply of integrated circuit designs and modem technologies for 3G and its evolution. The two companies are also negotiating a plan relating to transferring a part of Nokia’s Integrated Circuit operations to STMicroelectronics. The...
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Laird Opens Research Lab in India

Laird Technologies, designers and suppliers of customized performance-critical products for wireless and other advanced electronics applications, have established a Corporate Research Laboratory in Bangalore, India. The focus of the new laboratory will be in the development of novel materials for use in electronic components and systems. The facility is...
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