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Skyworks Solutions Inc., an innovator of high performance analog semiconductors enabling a broad range of end markets, announced that several leading OEMs and smartphone providers are leveraging the company’s highly customizable, fully optimized SkyOne™ front-end solution.

Anritsu Co. introduces Windows-based remote control software for its PIM Master MW82119A, the industry’s first high-power, battery-operated, portable PIM test analyzer. With the software, field technicians on the ground can control an MW82119A configured on top of the tower, making it easier and more efficient to conduct highly accurate PIM measurements, especially for difficult-to-access sites, such as Remote Radio Head (RRH) installations.

Agilent Technologies Inc. introduced its new E6607C EXT wireless communications test set, featuring an integrated multiport adapter for cost-effective, high-volume wireless device manufacturing test. Optimized for testing multiple devices simultaneously, the EXT-C with integrated multiport adapter enables up to 3x gain in effective test throughput (vs. the EXT-B) for less than 1.3x the price.

Analog Devices Inc. (ADI) announced the release of a new version of its popular ADIsimRF™ design tool. The free design tool is the software accompaniment to ADI's complete portfolio of RF-to-digital functional blocks, allowing engineers to model RF signal chains using devices from across ADI's RF IC and data converter portfolio.

BAE Systems and Lockheed Martin Corp. recently completed a series of successful guided flight tests for 155-mm Long Range Land Attack Projectiles (LRLAP) as part of the on-going qualification test program at White Sands Missile Range in New Mexico.

Lake Shore announces a new continuously variable temperature (CVT) probe, developed in collaboration with TOYO Corp., that allows for true, continuous unattended wafer probing of a material sample across a range of temperatures. The probes, when used in any Lake Shore probe station, significantly improve reliability of sample measurement.

Nujira Ltd., the world leader in Envelope Tracking (ET) technology, has celebrated the opening of the 2013 Mobile World Congress in Barcelona by announcing that it has passed the 200 patent mark. Nujira has the most extensive ET IPR portfolio in the industry and this latest milestone demonstrates Nujira’s continuing innovation in developing ET for use in modern digital communications.

TI announced two new software packages for its KeyStone-based multicore system-on-chips (SoCs): a new production ready small cell Physical (PHY) software package and a transport software package for wireless and other network-oriented applications.

Rohde & Schwarz has tailored its mid-range measuring instruments to handle WLAN signals in line with IEEE 802.11ac. Using the R&S SMBV100A and R&S FSV, manufacturers of WLAN chipsets, components and devices can now easily generate and analyze signals with 160 MHz bandwidth.

Richardson RFPD Inc. announced the launch of a new website resource focused exclusively on Gallium Nitride (GaN).