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SenarioTek announced the extension of the FlexMatrix reconfigurable RF switch matrix series to incorporate external signal conditioning. Now test engineers can easily route their required signal conditioning into RF switching paths for applications such as radar, military communications and consumer wireless.
Agilent Technologies Inc. announced a new protocol testing solution for MIPITM Alliance Gear2 DigRf v4 RFICs. The Agilent M9252A DigRF host adapter allows developers to speed testing and analysis of RFICs used in cellular phones, tablets and other mobile devices.
Thales announced a new LRIP contract for secure radios to support the U.S. Army's Nett Warrior Program. The radio is capable of providing soldiers with access to the government's classified networks at the Secret or Sensitive But Unclassified level.
National Instruments announced 10 pieces of new application IP that enable engineers and scientists to use NI LabVIEW system design software to build their own custom RF instruments. This IP integrates with PXI FPGA targets such as the NI PXIe-5644R VST and extends their default capabilities.
To meet the demanding needs of pyrotechnic engineers, Vishay Intertechnology Inc. introduced a new massive electro-pyrotechnic ignitor chip (MEPIC) resistor offering Joule effect or flash ignition for fast firing times down to 250 µs.
Richardson RFPD Inc. announces its participation and the line-up of suppliers and products it will feature at IIC China 2013, to be held at the Shenzhen Convention & Exhibition Center, Shenzhen, China, February 28 to March 2, 2013.
M/A-COM Technology Solutions Inc., a supplier of high performance analog semiconductor solutions, announced a new broadband diplexer, specifically designed for CATV Customer Premises Equipment (CPE) applications.
The Taiwanese telecommunications company Chunghwa Telecom, as the prime contractor, has awarded Cassidian the contract to deploy an island-wide TETRA network in Taiwan.
Nujira Ltd. has released the details of significant test results that demonstrate how Envelope Tracking (ET) technology unlocks the potential of RF CMOS PAs for high end 3G and 4G smartphone applications.