Keysight Technologies Inc. announced significant updates to its Signal Studio for LTE/LTE-Advanced FDD (N7624B) and TDD (N7625B) software. Both signal-creation tools now support key features of 3GPP Release 12 (Rel-12), accelerating time-to-market for developers of user equipment (UE) and evolved NodeB (eNB) base transceiver stations (BTS) designed to achieve greater spectral efficiency, higher data rates and more-robust links in heterogeneous networks (HetNets).
Peregrine Semiconductor Corp., founder of RF SOI (silicon on insulator) and pioneer of advanced RF solutions, announces the UltraCMOS® 11 platform, the industry’s first RF SOI technology built on GLOBALFOUNDRIES’ 130 nm 300 mm RF technology platform.
NXP Semiconductors held an Extraordinary General Meeting of Shareholders and Freescale Semiconductor held a Special General Meeting on NXP’s acquisition of Freescale. Both meetings approved the merger proposal with over 99 percent of the votes cast in favor.
Amphenol Connex has merged with Amphenol RF, headquartered in Danbury, Conn. The combined product portfolio will be marketed and sold under the name Amphenol RF. The Moorpark, Calif. facility will continue to operate as the company’s main North American distribution center and Amphenol RF’s western regional sales office providing support to local customers.
Keysight's CXA-m signal analyzer, with a built-in tracking generator, now has 3, 7.5, 13.6 and 26.5 GHz options, making it the industry’s first modular stimulus response measurement solution and providing the industry’s highest tracking generator frequency coverage.
Richardson Electronics Ltd. announced the launch of a new business group, Power & Microwave Technologies (“PMT”). The PMT group encompasses Richardson Electronics’ existing Electron Device Group (“EDG”) and adds new technologies and engineered solutions for the power conversion and RF and microwave markets.
Vishay Intertechnology Inc. announced that the company has enhanced its T55 series of vPolyTan™ surface-mount polymer tantalum molded chip capacitors with eight new ratings in the A, B, and T (low-profile B – 1.2 mm max.) case sizes.