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Industry News

Nokia begins headcount reductions

Company promised €900M in synergies from Alcatel-Lucent acquisition

Nokia logoNokia announced initial actions to reduce company personnel, part of a "synergy and transformation program" following the acquisition of Alcatel-Lucent. Nokia is targeting €900 million of operating cost synergies to be achieved by the end of 2018.


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Skyworks unveils next generation SkyLiTE solutions

Skyworks Solutions Inc., an innovator of high performance analog semiconductors connecting people, places and things, unveiled SkyLiTE™ 2.0, its next generation front-end solution powering LTE devices. This highly integrated platform provides smartphone manufacturers with a complete front-end system that meets today’s carrier aggregation (CA) design challenges.


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Sierra Wireless and Richardson RFPD sign global distribution agreement

Richardson RFPD Inc. announced an expanded global franchise agreement with Sierra Wireless. The new agreement builds on the long-term collaboration between the two companies, as well as a mutual commitment to serve the emerging industrial IoT market. Under the terms of the agreement, Richardson RFPD will sell Sierra Wireless cellular modules and modems to its global audience.


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TowerJazz announces its SiGe Terabit Platform enabling high-speed wireline communications

TowerJazz, the global specialty foundry leader, announced its SiGe Terabit Platform targeting high-speed wireline communications for the terabit age. Wireline data traffic is increasing dramatically, with traffic at Google famously increasing by 50 times over the last six to seven years, or at 75 percent per year. Estimates vary, but experts agree on double digit CAGRs and a 2020 market for high speed optical components in excess of $9 billion. TowerJazz addresses this market through a family of customized foundry silicon-germanium (SiGe) BiCMOS technologies and is announcing availability of its highest performance process to date: S4.


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Richardson Electronics at EDI CON 2016

Richardson Electronics Ltd. announces its participation at EDI CON CHINA 2016. The Electronic Design Innovation Conference (EDI CON) brings together leading RF, microwave, high-speed analog and mixed signal components, semiconductor, test and measurement equipment, materials and packaging, EDA/CAD and system solution providers.


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