Industry News

SUSS and 3M Form 3-D Packaging Bond

3M and SUSS MicroTec have agreed to expand access to 3M Wafer Support System (WSS) equipment for temporary wafer bonding of ultra-thin wafers required for 3-D packaging. As part of this non-exclusive agreement, SUSS MicroTec becomes an authorized equipment supplier for the 3M WSS and will manufacture and sell...
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RFMD Announces Availability of GaN Foundry Services

RF Micro Devices Inc. (RFMD), a leader in the design and manufacture of high performance semiconductor components, announced the company has formed a gallium nitride (GaN) Foundry Services business unit to supply high reliability, high performance and price-competitive GaN semiconductor technology into multiple RF power markets. The RFMD GaN...
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Lockheed Martin Selects M2 Global

Lockheed Martin has entered into a US Department of Defense Mentor-Protégé Agreement with M2 Global Technology Ltd. San Antonio, TX, a small business supplier to Lockheed Martin’s F-16, F-22 and F-35 programs. Over the one-year period of the Mentor-Protégé relationship, Lockheed Martin Aeronautics will assist and guide M2 Global,...
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EADS DS Takes Up International Sentry Duty

CalAmp Corp. has entered into an exclusive agreement with EADS Defence & Security (EADS DS) to supply a customised version of its WiMAX-based Sentry 4G™ Wireless IP Router, a new rugged broadband communications and networking platform for mission critical broadband communication applications. The custom high power mobile data terminal...
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