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Industry News

A Three-dimensional EM Field Solver for High Frequency Applications

A three-dimensional electromagnetic (EM) field simulator that implements a full-wave solution of Maxwell's equations using the finite element method
A Three-dimensional EM Field Solver for High Frequency Applications Structural Research & Analysis Corp. Los Angeles, CA Until recently, designing RF, microwave and mm-wave circuits and components using electromagnetic (EM) field simulators was a luxury for the majority of engineers working in these fields. Today, thanks in part to...
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An Active Physical Device Simulator

A simulator system that makes it possible to vary the physical parameters for the active device
An Active Physical Device Simulator HP Eesof Santa Rosa, CA Circuit designers have enjoyed the benefits of sophisticated simulation tools for some time. However, these simulation programs are limited to circuit optimization and characterization and are forced to describe the active device by means of established or measured equivalent...
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A 2.2 to 2.4 GHz Dual 8 x 2 Switch Matrix

A switching matrix that is both phase and amplitude balanced to assure proper operation and provide a low loss path with good isolation
A 2.2 to 2.4 GHz Dual 8 x 2 Switch Matrix Technical Research and Manufacturing Inc. (TRM) Bedford, NH One of the key components of a phased-array radar system is the RF switching network that directs the various RF signals to and from the respective antenna elements. This switching...
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CDMA RFIC Upconverters

Upconverters designed specifically for the transit sections of both dual-mode code-division multiple access (CDMA)/FM cellular and personal communications service handset applications
CDMA RFIC Upconverters QUALCOMM Inc. San Diego, CA Few products are on a faster track than today’s digital wireless handsets. Currently, the industry is scrambling to meet the demand for these improved telephones. As a result, component manufacturers must generate new devices that enable the handset manufacturers to design...
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Chip-size Package Technology for Semiconductors

A novel chip-size ball-grid array package construction, process flow and reliability data
Chip-size Package Technology for Semiconductors Chip-scale packaging (CSP) of IC devices is rapidly gaining acceptance worldwide because of intrinsic size advantages, the promise of highly favorable cost/performance trade-offs and reliance on existing materials and assembly infrastructures. The compliant, flex-circuit-based package is increasingly being viewed as the CSP method of...
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Designing High Speed Paging Systems

Solutions and approaches to the design of new pagers and the software, hardware and semiconductor products that are becoming standard in this area
Designing High Speed Paging Systems The area of pager systems is changing with the introduction of new paging standards, particularly FLEX, in all worldwide markets. The semiconductor concepts for new pagers are developing rapidly toward even higher integration. Single-chip concepts, including decoding, controller tasks, level shifting, frequency synthesizer and...
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Behavior of GaAs FET Pulsed IV Characteristics

A comparison of the IV characteristics of GaAs MESFET devices acquired under a variety of pulsed conditions
Behavior of GaAs FET Pulsed IV Characteristics The IV characteristics of GaAs MESFET devices acquired under a variety of pulsed conditions are compared. The results show that the differences between the static and pulsed characteristics are not due to thermal effects alone as is sometimes assumed. J. Rodriguez-Tellez University...
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A Versatile Test Bench for Wireless RF/Microwave Component Characterization

A low cost RF/microwave test bench comprising a network analyzer, spectrum analyzer and signal source fro measurements between 0.3 and 3 GHz
A Versatile Test Bench for Wireless RF/Microwave Component Characterization Recent advances in instrumentation, motivated by the volume and cost demands of the commercial wireless marketplace, allow a powerful RF/microwave test bench to be assembled at relatively low cost. A versatile test bench comprising a vector network analyzer (VNA), spectrum...
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Multilayer Bonding and Fabrication Guidelines

Fabrication of reliable, low cost multilayer structures aided by new materials and increased information
Multilayer Bonding and Fabrication Guidelines John Bushie Taconic ADD Petersburgh, NY Increased performance requirements, packaging size and cost reductions have placed a new pressure on the RF design engineer and PCB fabricator to develop new and innovative solutions. One of the recent approaches to achieving these objectives is combining...
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Around the Circuit

Around the Circuit INDUSTRY NEWS Shareholders of Northrop Grumman Corp. have approved a merger pursuant to which the company will become a wholly owned subsidiary of Lockheed Martin Corp. Of the more than 54 million shares voted (representing approximately 80 percent of the total shares outstanding), more than 97...
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