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Industry News

WCDMA Application of Gain Blocks

Description of the detailed operating characteristics of InGaP HBT gain block products that are widely used in 2G, 2.5G and 3G applications
Product Feature WCDMA Application of Gain Blocks EiC Corp. Fremont, CA This article deals with the detailed operating characteristics of InGaP HBT gain block products that are widely used in 2G, 2.5G and 3G applications, using 3G WCDMA as the example. The linearity, expressed by adjacent channel leakage ratio...
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A New Wideband Family of Oscillators

Introduction to a new line of voltage controlled oscillators designed to increase power and widen bandwidth by incorporating multiple tuned circuits
Product Feature A New Wideband Family of Oscillators Vari-L Co. Inc. Denver, CO Modern communication systems are designed to handle ever increasing amounts of data by utilizing more bandwidth and more sophisticated modulation schemes. Voltage controlled oscillators (VCO) are used in almost all radio and RF applications including cell...
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Measurement of On-wafer Transistor Noise Parameters Without a Tuner Using Unrestricted Noise Sources

Presentation of a method for calibrating the four noise parameters of a noise receiver that does not require a tuner
Technical Feature Measurement of On-wafer Transistor Noise Parameters Without a Tuner Using Unrestricted Noise Sources This article presents a method for calibrating the four noise parameters of a noise receiver which does not require a tuner. The method permits using general (mismatched) noise sources, which may present very different...
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Two-tone vs. Single-tone Measurement of Second-order Nonlinearity

Use of a method to correctly locate the second-order intercept point (IP2) from one- and two-tone tests
Technical Feature Two-tone vs. Single-tone Measurement of Second-order Nonlinearity Darioush Agahi, William Domino and Nooshin Vakilian Conexant Systems Inc. Newport Beach, CA This article describes how to correctly find the second-order intercept point (IP2) from one- and two-tone tests, and presents measurement results in support of the theory. Relation...
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Fixing the Curtice FET Model

Method used to prevent convergence difficulties in the Curtice model when parameter extraction is imperfect
Technical Feature Fixing the Curtice FET Model Convergence difficulties are common in nonlinear analyses of circuits using a Curtice model. The problem is not the model itself, but the limitations of the parameters describing the gate I/V characteristic. In this article, we show why that failure occurs, and how...
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Simulating Multi-finger HBTS

Introduction to a new model of multi-finger heterojunction bipolar transistors used to analyze and predict current collapse, bias dependence and output power
Technical Feature Simulating Multi-finger Power HBTs A new model of multi-finger heterojunction bipolar transistors (HBT) is presented to analyze and predict current collapse, bias dependence and output power. The simulation of multi-finger HBTs has proven to be very challenging in both computer-aided design and electromagnetic (EM) simulation. However, by...
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New Products

New Products COMPONENTS SP4T Switch The model AS204-80 GaAs IC SP4T switch combines high isolation to provide greater sig- nal path separation and reduced RF leakage with non-reflecting ports to eliminate the need for external terminations while providing 50 W output impedance. Covering the frequency range of DC to...
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Around the Circuit

Around the Circuit INDUSTRY NEWS Advanced Power Technology Inc. (APT) has entered into a definitive agreement to acquire GHz Technology Inc. Under the terms of the agreement, APT will issue approximately 1.48 million shares of common stock and $13.3 M in exchange for the business and assets of GHz...
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New Literature

New Literature General Purpose Test Instruments Catalog This 64-page, full color catalog contains detailed information on more than 330 of the company's newest test and measurement products, accessories and support services that can help R&D and manufacturing test engineers. The catalog is designed to help engineers find product information...
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Workshops & Courses

Workshops & Courses International Workshop on Wafer Level CSP and Flip Chip Packaging Topics : Wafer level packaging materials and processes, wafer level burn-in and test, small die and memory products, ultra-high density substrate technologies for WLP, new and advanced wafer technologies, wafer package reliability. Site : Stone Mountain,...
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