Industry News

UMS Relocates Wafer Back-Side Activity

As part of an on-going commitment to continuous improvement, United Monolithic Semiconductors (UMS) has announced that it is relocating its wafer back-side activity from its facility in Orsay, France, to that in Ulm, Germany. This strategic move concentrates the company’s wafer fabrication in Ulm, thus providing manufacturing synergies and...
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Modelithics Introduces New System Component Library

Modelithics is pleased to announce the introduction of an exciting new class of models to The Modelithics Library™ of high accuracy RF and microwave simulation models. The System Component Library (or SCL Library™) will include a collection of accurate linear and nonlinear models for functional system blocks including filters,...
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The Science of Murata Boy

In a Downloadable PDF
Heading to IMS 2007? Make Some Time To Meet MURATA BOY Who: Murata Electronics’ Infamous MURATA BOY What: You’ve probably heard about and may have even seen stories – now it’s your chance to see MURATA BOY, the bicycle riding robot, in action. He features a number of the...
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Taconic to Showcase Multilayer Capability

The Advanced Dielectric Division of Taconic will feature a variety of unique products that offer low loss and high reliability for conventional and multilayer RF and high speed digital board fabrication at this year's MTT-S International Microwave Symposium. Taconic’s TacPreg prepregs, constructed with BT epoxy/woven fiberglass/PTFE components, offer reduced...
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