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Industry News

AMPLIFIERS

December 1, 1997
AMPLIFIERS Special-purpose RF Amplifiers The models 75AP250 (75 W minimum power) and 250AP250 (250 W minimum power) special-purpose RF amplifiers offer fast blanking circuitry to eliminate noise at the conclusion of an RF pulse or series of pulses so that the effects of the applied RF can be detected...
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LIGHTWAVE

December 1, 1997
LIGHTWAVE Laser Chip The 980nm series laser chip is designed for use in the manufacture of 980 nm pump modules, which serve as a critical component in optical fiber amplifiers. The unit serves as an important component in the deployment of high speed, high capacity telecommunication systems. Lasertron Inc.,...
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DEVICES

December 1, 1997
DEVICES High Power Efficiency GaAs FETs The MGF0900 series N-channel Schottky gate GaAs FETs are designed for use in UHF-band power amplifier applications and provide versatility where power is a priority. The models MGF0909A, MGF0910A and MGF0911A 2.3 GHz GaAs FETs are all included in the series. The model...
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SOURCES

December 1, 1997
SOURCES PCS Handset VCOs The MW 400 series VCOs are designed for use in applications where small size and low cost are critical. The versatile VCOs are available in frequency ranges from 1 to 2.8 GHz in bandwidths of 75 to 100 MHz. Tuning voltage is 0.5 to 4.7...
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TEST EQUIPMENT

December 1, 1997
TEST EQUIPMENT Portable Spectrum Analyzer The SCOPE 4600 series portable spectrum analyzer is designed for convenient measurements in the field, mobile test setups and in test laboratories. The unit also is suited for broadband measurements with selectable resolution bandwidths up to 1000 MHz. The analyzer features a lighted graphical...
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SUBSYSTEMS

December 1, 1997
SUBSYSTEMS 10 Mbps Bit Synchronizer The model AVME 335 full-function, 10 Mbps tunable bit synchronizer is suited for use in reconstructing a noisy input pulse code modulation (PCM) data stream and providing a clean PCM signal with a coherent clock. The synchronizer is tunable over the bit rate range...
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PROCESSING EQUIPMENT

December 1, 1997
PROCESSING EQUIPMENT Production Flip-chip Bonder The model FC250 high end, production flip-chip bonder offers alignment and leveling accuracy better than 2 mm. The throughput lies over 200 units per hour. A production-worthy system to level, align and bond even nonreflective components, the bonder supports the complete range of bonding...
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SOFTWARE

December 1, 1997
SOFTWARE Electromagnetic Analysis System Software The model EMAS V4.0 electromagnetic analysis system software predicts coupled electromechanical performance of various electrical apparatus, resulting in greater design insight and reduced development cycles. The software couples the accuracy of electromagnetic, structural and thermal finite element analysis to account for the effects of...
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News from Washington

November 1, 1997
News from Washington Towed Decoys Could Improve Navy Aircraft Survivability In a recent report (GAO/NSIAD-97-94), the General Accounting Office (GAO) has reviewed Department of Defense (DoD) plans to acquire the ALE-50 and radio frequency countermeasures (RFCM) towed decoy systems. The RFCM system includes a more advanced decoy and is...
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International Report

November 1, 1997
International Report GEC Tests New Approach to Monolithic Filtering at Microwave Frequencies UK contractor GEC is working on active filtering at UHF (0.3 to 1 GHz) and microwave frequencies using a silicon-on-insulator (SOI) bipolar IC process. At the heart of the effort is the use of pairs of silicon...
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