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Industry News

Agilent Signs Expanded Agreement with Peregrine Semiconductor

Agilent Technologies Inc. announced a multi-year, multi-site agreement in which Peregrine Semiconductor has expanded its investment in Agilent Technologies' RFIC design tools, designed to boost productivity and production yields. "Our designers rely heavily on Agilent's EDA tools for their success," said John Sung, director of CAD engineering at Peregrine....
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SARFT Takes Mobile TV Lead

China’s Broadcasting Regulatory Authority Aims for Homegrown Standard
During the past few months, China has turned its attention to mobile TV. The State Administration of Radio, Film and TV (SARFT), the top regulator for the broadcasting industry, has made its foray into mobile TV with a plan to deliver TV content to handsets and a slew of...
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US DoD Awards Technical Communities Strategic Sourcing Contract

The US Department of Defense’s (DoD) Naval Inventory and Control Point (NAVICP) has awarded Technical Communities Inc. , a leading marketplace operator and service provider for the IT, network maintenance and test and measurement industry, a contract to operate and enhance the strategic sourcing online marketplace for the General...
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Robert St. Pierre Joins TRU Corp.

TRU Corp. announced that Robert St. Pierre has joined the company as director of sales, a new position, reporting to Tony Martiniello, vice president of business development and engineering. St. Pierre will have direct responsibility for all TRU sales functions both internally and externally, and the regional managers will...
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Lytron Opens New Factory and Offices in Woburn, MA

Lytron Inc. recently announced the completion and opening of its new factory and corporate office space in Woburn, MA. With this new space north of Boston, Lytron has doubled its square footage and increased its manufacturing capabilities, positioning itself for continued growth. It has also made room for equipment...
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Rogers Corp. Presents RO4450B&trade-dx Bondply at EuMW

Rogers Corp. introduced its new RO4450B™-dx Bondply, a high fill/flow version of the RO4450B high frequency circuit material, at last week's European Microwave Week. RO4450B circuit material is a glass-reinforced hydrocarbon/ceramic thermoset bondply designed for performance-sensitive, multilayer printed circuit boards. These bondplys are designed to offer superior high frequency...
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