Industry News

Lockheed Martin Successfully Tests Common Electronics Warfare System for Navy

Lockheed Martin Integrated Common Electronics Warfare System (ICEWS)—a single enterprise solution designed to scale across all ship classes in the US Navy’s surface fleet—performed successfully during a series of just-completed demonstrations conducted by the Navy. The at-sea demonstration of ICEWS, held beginning in June, followed recent land-based testing and...
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Raytheon’s SLAMRAAM Completes System Field Integration Testing

Raytheon Co.’s Surface Launched Medium Range Air-to-Air Missile (SLAMRAAM) successfully completed system field integration testing at White Sands Missile Range, NM, demonstrating interoperability with both Patriot an Avenger weapon systems. “Successful integration testing will help put this much-needed air defense capability into our warfighter’s hand,” said Pete Franklin, vice...
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Semiconductor Makers Team Up for eWLB Technology

STMicroelectronics (headquartered in Switzerland), STATS ChipPAC (Singapore) and Infineon Technologies AG (Germany) have signed an agreement to jointly develop the next-generation of embedded Wafer-Level Ball Grid Array (eWLB) technology, based on Infineon’s first-generation technology, for use in manufacturing future-generation semiconductor packages. ST and Infineon, two of the world’s leading...
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£236.5 M Investment in UK Science and Technology

The UK’s Science and Technology Facilities Council (STFC) has earmarked £236.5 M for investment to develop large-scale research facilities and projects in its science portfolio. The investment, which was announced by the Department for Innovation, Universities and Skills (DIUS), is being made available through the UK Government’s Large Facilities...
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Nokia and Qualcomm Enter New Technologies Agreement

Nokia and Qualcomm have entered into a new agreement covering various standards, including GSM, EDGE, CDMA, WCDMA, HSDPA, OFDM, WiMAX, LTE and other technologies. Under the terms of the new 15-year agreement, Nokia has been granted a license under all Qualcomm’s patents for use in Nokia’s mobile devices and...
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The End Book

RF & Wireless Technologies: Know it All Newnes, an imprint of Elsevier 846 pages; $55.95, £29.99 ISBN: 978-0-7506-8581-8 Few areas of technology are as dynamic and fast-growing as RF and wireless. Recent years have seen myriad new technologies and devices introduced, with many more on the way. Keeping fully...
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TECOM and QEST Join Forces

TECOM Industries , a Smiths Interconnect company that is part of the global technology business Smiths Group, and German antenna developer QEST Quantenelektronische Systeme GmbH announced a teaming agreement to jointly produce and market airborne broadband antennas for in-flight connectivity. In response to the growing market demand, the partnership...
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NEC Secures Mobile Backhaul Project with Indosat

PT Indosat Tbk , Indonesia’s second largest mobile phone carrier, has selected NEC Corp. to implement a mobile backhaul IP migration project that utilizes existing networks to transfer systems into the latest IP structure. The project will utilize NEC’s ultra-compact PASOLINK microwave communications systems and CX2600 service consolidation switches....
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