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Industry News

e2v Meets X-ray Specs

e2v technologies has been selected to participate in the industrialisation phase for a key part of the X-ray Free Electron Laser (XFEL) research project based at DESY (the German Electron Synchrotron) in Hamburg, Germany. DESY’s partner, the LAL Orsay Laboratory of CNRS (the National Centre for Scientific Research), is...
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GaN Early Commercial Opportunities Lie in High Power Electronics

Strategy Analytics’ latest study, “Gallium Nitride Markets: Commercial Markets Drive Power Electronics,” concludes that military and high power electronics (HPE) applications will be the catalysts for the development of a gallium nitride (GaN) device market through 2010. Commercial wireless infrastructure applications will also drive demand in the future and...
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China Will Be Largest IC-consuming Country by 2010

China is becoming the world hub for both semiconductor manufacturing and consumption, reports In-Stat. China consumed about 20 percent of total global semiconductor products in 2004; by 2010, it will consume one-third, making it the world’s largest semiconductor consumer, the high tech market research firm says. “China’s government policy...
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UWB Shipments to Reach Nearly 300 Million in 2011

Several formidable-looking barriers appear, at first glance, to pose serious obstacles to widespread commercial success for ultrawideband (UWB). But closer examination reveals that few of them will drastically inhibit the market which, a new ABI Research study forecasts, will see nearly 300 million UWB shipments in 2011. According to...
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Global 3G Subscribers Pass 100 Million Mark in June

Strategy Analytics’ on-going research into 3G subscriber tracking shows that more than 100 million people around the globe are now using WCDMA and CDMA2000 1x EV-DO 3G technology on their mobile phones, according to “Global 3G Subscribers Hit 100 Million Mark in June,” published recently. 3G-user momentum is ramping...
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Around the Circuit

Industry News Rosenberger of North America LLC and Agilent Technologies Inc. announced that they have signed an agreement for Rosenberger to purchase assets and to license technology used by Agilent at its Santa Rosa, CA, cable assembly shop. Upon completion of the sale, Agilent will obtain these products and...
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Agilent to Acquire Xpedion Design Systems

Agilent Technologies Inc. and Xpedion Design Systems Inc. announced they have signed a definitive agreement for Agilent to acquire Xpedion, a privately held company that provides software for wireless and high speed digital circuit and systems design in the communications industry. The transaction is subject to standard closing conditions....
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RF to Light 100 Update

The RF to Light 100 jumped 5% last week, YTD 0% at 2124 with market sectors RF semiconductors and RF components both up 8%. # 2 chip maker Texas Instruments reported strong growth in sales of wireless chips (up 27%) with the help of its customers Nokia, Motorola and...
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Microwave Communication Contract for NEC in Norway

NEC Corp. has signed a global framework contract with Telenor , the Norwegian fixed and mobile telecommunications operator, for the supply of a long-haul, large capacity telecommunication backbone, SDH microwave communication systems (the 3000/5000 Series), point-to-point access microwave radio systems (the Pasolink Series) and related services such as installation...
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