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Industry News

Chomerics Opens New Facility

Chomerics Asia Pacific division of Parker Hannifin Corp. announced the opening of a new facility in Sriperumbudur near Chennai, India. Located adjacent to the 260 acre Special Economic Zone, the facility will enable Chomerics to better serve the rapidly growing Indian market for IT, telecom and consumer electronic products....
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Tower Wins Fab2 Deal with Top-tier US IDM

Tower Semiconductor Ltd. , a pure-play independent specialty foundry, announced that it has won a multi-million dollar per month manufacturing deal for its Fab2 at the 0.13-micron technology generation from a first-tier, US integrated device manufacturer (IDM). Under this deal, technology will be transferred during the coming several quarters...
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Keithley and CNSI Announce Nanotechnology Measurement Partnership

Keithley Instruments Inc. , a leader in solutions for emerging measurement needs, announced a new partnership with The California NanoSystems Institute (CNSI) at UCLA. The partnership is designed to support research collaboration in the pursuit of nanotechnology and nanoscience solutions for the semiconductor industry's next generation instrumentation and measurement...
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Agilent’s Latest Genesys Software Provides First-pass RF/Microwave Accuracy

Agilent Technologies Inc. announced that the company is shipping Genesys 2007.08. This latest release of Genesys includes new statistical and electromagnetic analyses that provide affordable, first-pass accuracy for RF and microwave designs, resulting in shorter physical design cycles and faster time to market. The new Genesys features the RF...
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Remcom Announces Availability of XStream V 3.0

Utilizing the ability of the Graphics Processing Unit (GPU) in modern computer graphics cards to stream floating point calculations, Remcom ’s XFdtd full wave 3D EM solver achieves extremely fast calculation speeds via the XStream® Hardware FDTD option. The new Version 3.0 of XStream Hardware FDTD is now based...
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Northrop Grumman Teams with USAF and FAA to Study Pilot Response to Lasers

The US Air Force and the Federal Aviation Administration (FAA) led a team that included Northrop Grumman Corp. and its partners, Taboada Research Instruments and Cherokee CRC, to design, build and integrate a one-of-a-kind laser positioning system in a Boeing 737 flight simulator to study flight performance while aircrews...
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Raytheon Awarded Contract to Evolve the DCGS Integration Backbone to the USAF

Raytheon Co. has been awarded a US Air Force contract to develop the next generation of the Distributed Common Ground System (DCGS) Integration Backbone (DIB). The DIB is an architecture through which military analysts and the intelligence communities can collaborate globally, regardless of their military service affiliation, enabling joint...
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PULLNANO Consortium Reports Breakthrough

PULLNANO, a project sponsored by the European Commission within the 6 th Framework Program (FP6), has reported several important results related to the future-generation 32 nm and 22 nm CMOS technology platforms, including the realization of a functional CMOS Static Random Access Memory (SRAM) demonstrator built using 32 nm...
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ST and Nokia Expand 3G Collaboration

Nokia and STMicroelectronics have announced their intention to deepen their collaboration on the licensing and supply of integrated circuit designs and modem technologies for 3G and its evolution. The two companies are also negotiating a plan relating to transferring a part of Nokia’s Integrated Circuit operations to STMicroelectronics. The...
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