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Industry News

Teledyne LeCroy introduces a new USB 3.1 end-to-end test suite

Teledyne LeCroy introduces the QPHY-USB3.1-Tx-Rx package for automated USB 3.1 transmitter (Tx) and receiver (Rx) compliance testing, characterization, and debug, creating a unique and comprehensive USB 3.1 test suite. With the new test package, USB 3.1 testing can be performed on both Gen1 (5 Gb/s) and Gen2 (10 Gb/s) devices under test according to the latest USB 3.1 specifications.


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Qorvo ups optical bandwidth with new GaAs process technology

Qorvo, Inc., a leading provider of RF solutions for mobile, infrastructure and aerospace/defense applications, announced a new gallium arsenide (GaAs) pseudomorphic high electron mobility transistor (pHEMT) process technology that provides higher gain/bandwidth and lower power consumption than competing semiconductor processes. 


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NI to showcase NI AWR Design Environment software at EDI CON 2015

NI (formerly AWR Corp.) will be showcasing NI AWR Design Environment™ software at Booth #315 at the Electronic Design Innovation Conference 2015 (EDI CON), being held April 14-16 in Beijing, China. Additionally, NI AWR Design Environment software will be showcased in four 20-minute talks as well as one 40-minute workshop during the week.


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Tektronix announces 70 GHz real time oscilloscope with industry best signal fidelity

Tektronix, Inc., the world's leading manufacturer of oscilloscopes, announced the DPO70000SX 70 GHz ATI Performance Oscilloscope featuring the lowest-noise and highest effective bits of any ultra-high bandwidth real-time oscilloscope available on the market. The new oscilloscope incorporates a range of innovations that enable it to more effectively meet the current and future needs of engineers and scientists developing high-speed coherent optical systems or performing leading-edge research.


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Richardson RFPD/Arrow to organize GaN panel at EDI CON 2015

Leading companies on panel include Freescale, Qorvo, Macom and EmpowerRF

GaN Panel featuring experts from Freescale, MACOM, Qorvo and Empower RF

The panelists will discuss the attributes of GaN for RF applications including wireless, automotive, multimedia and communications, covering the semiconductors strengths and weaknesses for addressing specific applications compared to other existing technologies and its outlook for development and adoption in new application targeting higher frequency green-field initiatives.


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