Pasternack, a leading provider of RF, microwave and millimeter wave products, debuts brand new lines of waveguide bends operating from 5.85 to 90 GHz across 12 frequency bands (from C Band to W Band). These waveguide bends are commonly used in applications such as instrumentation, test benches, high efficiency RF, microwave and mm-wave transmissions, SATCOM, MILCOM, radar and telecom.
Researchers from North Carolina State University and the U.S. Army Research Office have developed a way to integrate novel functional materials onto a computer chip, allowing the creation of new smart devices and systems.
Skyworks, the largest and best performing RF semiconductor supplier, reported the first year-over-year sales decline in years, a reflection of the softness in iPhone sales. However, the company grew their mobile business in China and secured designs wins in the emerging Internet of Things (IoT) market.
AceAxis has signed an agreement with Thales, under which it will adapt its remote radio head design for use in a system providing broadband Internet connectivity to passengers on board commercial aircraft.
EDI CON USA 2016, a conference that brings together engineers working on high-frequency analog and high-speed digital designs, taking place September 20-22 in Boston, Mass. at the Hynes Convention Center, announces its Signal Integrity/Power Integrity track for this year’s conference and exhibition. The exhibition will host more than 138 exhibiting companies from the RF, microwave, and high-speed digital industries, including demonstration pods in the Signal Integrity Zone.
Qorvo®, a leading provider of innovative RF solutions that connect the world, and Levarys, a leading developer and manufacturer of smart thermostat solutions, announced that Levarys’ new Luna Smart Home System for energy management includes ZigBee chips from Qorvo’s Low Power Wireless business (formerly GreenPeak Technologies).
Dassault Systèmes, the 3DEXPERIENCE Company, world leader in 3D design software, 3D Digital Mock Up and Product Lifecycle Management (PLM) solutions, announced it has entered into a definitive agreement to acquire CST - Computer Simulation Technology AG, the technology leader in electromagnetic (EM) and electronics simulation, for approximately 220 million euros.
TE Connectivity (TE), a world leader in connectivity and sensors, announces its new Ruggedized Optical Backplane interconnect systems that provide a high-density, blind-mate optical interconnect in a backplane/daughtercard configuration. The half-sized connectors are fully compliant to the ANSI/VITA 66.4 standard.
Rogers Corp. introduces RO4730G3™ UL 94 V-0 antenna-grade laminates to meet present and future performance requirements in active antenna arrays and small cells, notably in 4G base transceiver stations (BTS) and Internet of Things (IoT) applications as well as emerging 5G wireless systems.