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Industry News

Tough Times for Discrete Power Semiconductor Manufacturers

Economic downturn and inventory building have produced manufacturers in the highly competitive discrete power semiconductor market who are severely restrained by low prices and will continue to face difficulty in generating sustainable profits. A new analysis from Frost and Sullivan, “World Discrete Power Semiconductor Markets,” reveals that revenues in...
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The Book End

Passive RF and Microwave Integrated Circuits Leo G. Maloratsky Newnes — An imprint of Elsevier 368 pages; $69.99 ISBN: 0-7506-7699-X The last four decades have been marked by the rapid development of RF and microwave integrated circuits, which offer the advantages of compact, lightweight designs with enhanced performance, higher...
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An RF Component Analyzer for Measuring Multi-function RF Modules

Communications services such as mobile phone and wireless LAN have increased the use of multi-bands while the terminals are becoming smaller. These trends have led to the widespread use of RF modules combining multiple functions. Along with this trend is the ability to make increasingly complex measurements more efficient....
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Low Profile, High Performance Surface Mount Couplers

A new family of low profile, high performance couplers has been introduced in a new easy-to-use, manufacturing friendly surface-mount package. These new couplers feature lower insertion loss, better phase balance, less amplitude imbalance, and higher isolation and directivity than previous offerings in this area. The new parts are much...
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Thermally Stable PCB Material

A new printed circuit board material has been developed to meet the demanding requirements for dielectric constant temperature stability and plated hole reliability for high temperature and varying environmental conditions. TSM-30 is based on a high temperature, low loss organic combined with ceramic. The material exhibits superior low loss,...
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A Magnetic MEMS-based RF Relay

Micro-electromechanical systems (MEMS)-based products run from the mundane of automobile air-bag sensors to the over-hyped optical switching fabrics of the recent telecommunications bubble. For some time now, design engineers have been waiting for the advantages of MEMS fabrication techniques to be successfully applied to the problem of RF and...
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