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Industry News

NEW WAVES: EuMW PRODUCT SHOWCASE

The following booth numbers are complete as of August 20, 2004. Test Software The InterLab® program is available in three different versions including InterLab Solo, Professional (two to five users) and Enterprise (over five users). With InterLab, only one tool is necessary to make engineering processes, test and measurement...
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Around the Circuit

Industry News Endwave Corp. , a provider of radio frequency subsystems for aero-defense, security and commercial wireless applications, announced the acquisition of all of the outstanding shares of capital stock of JCA Technology Inc. , a wholly-owned subsidiary of Bookham Technology plc., for approximately $6 M in cash. JCA...
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Web Update

Ultra-precision Service This company’s Web site offers a complete ultra-precision service for grinding, lapping, polishing, diamond sawing, laser machining and sizing a wide variety of metals (ferrous and non-ferrous). The company also offers carbide, ceramic, sapphire and other materials for industrial and scientific applications in the telecommunications, semiconductor, communications,...
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Low Voltage Surface-mount Crystal Oscillators

The trend for lightweight, low voltage battery operation in many of today’s consumer and communications equipment has driven the need for low voltage, high performance products for use in these systems. To meet these needs a new series of 5 × 7 mm surface-mount HCMOS crystal oscillators has been...
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A 10 MHz to 22 GHz MMIC Amplifier with 1 W Output

MMIC amplifiers that are efficient and deliver high power output over a very broad frequency range are extremely desirable in applications ranging from microwave instruments to electronic warfare systems. In addition to reducing the number of devices required to produce a desired RF power level, they consume less current...
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A Design Suite Built for Speed

Ask any engineer what is needed from an RF/microwave design tool and you will think you are stuck in a scene from Top Gun : “I feel the need for speed.” The thirst for greater simulation speed is never quenched, although model accuracy is just as important. Go across...
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A Surface-mount Plastic-packaged 1 to 18 GHz Low Noise Driver Amplifier

With the introduction of the MAAMGM0002, M/A-COM adds a cost-effective, highly manufacturable surface-mount plastic-packaged wideband driver amplifier to its array of standard products. The MAAMGM0002 provides 10 dB gain from 1 to 18 GHz, with a corresponding 4 dB typical noise figure and up to 21 dBm output power...
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The Design of a Dual Polarized Vivaldi Array

In this article, the design of a dual polarized Vivaldi antenna array is described. The Vivaldi elements are fed by broadband microstrip-to-slotline baluns. A 2:1 bandwidth (3.4 to 7 GHz) was achieved for VSWR, gain and cross-polarization isolation. Th...
The design for the Vivaldi antenna is motivated by the need for a broadband measurement antenna for an antenna test range (ATR). The ATR is capable of a dual axis rotation to create 3-D plots and to calculate the total radiated power (TRP). 1 The TRP calculation involves the...
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Potential Applications of PBG Engineered Structures in Microwave Engineering: Part II

The second part of this article reviews the potential applications of electromagnetic bandgap (EBG) structures in enhancing the performance of waveguides and antennas. A conductor-backed coplanar waveguide (CB-CPW) free of spurious transmission and a t...
In the new millennium, the explosion of info-communication technologies has brought many new broadband design challenges. To meet these challenges, designers are required to fulfill more functionality per unit volume. In the first part of this article, the basic PBG configurations and application of PBG structures in enhancing the...
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Automating and Optimizing High Performance LTCC Design

Low temperature co-fired ceramic (LTCC) is an increasingly popular technology that has the potential for increased reliability, improved electrical performance, size reduction and reduced cost. The LTCC process allows passive components such as resistors, inductors and capacitors to be embedded in a multilayer, integrated module with high density and...
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