Industry News

RFMD Completes Acquisition of Sirenza Microdevices

RF Micro Devices (RFMD), a global leader in the design and manufacture of high performance radio frequency systems and solutions, announced the completion of its acquisition of Sirenza Microdevices Inc. , a supplier of radio frequency components. Under the terms of the definitive merger agreement, each outstanding share of...
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Huber + Suhner Grants License to Tyco

Huber + Suhner has agreed that in the future its patented ODC fiber-optic connector range will be marketed under license by Tyco Electronics as a second source supplier. Following on from the company’s existing alliance with the French electronic components manufacturer Radiall SA, this latest agreement is a tie...
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Make a Date with CST of America

CST of America® Inc. has announced that the 5 th North American Users’ Forum will be held on 4 February 2008 in Santa Clara, CA. The conference will provide an opportunity for users of the company’s products to present and discuss their work to a wide audience of interested...
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Tower to Reach New Heights with Office in Taiwan

To support its increasing presence throughout the Asia Pacific region, Tower Semiconductor Ltd. is opening an office in Hsinchu, Taiwan, which will serve existing and future regional customers. The independent foundry provides cost-effective manufacturing foundry services in digital CMOS process technologies, specializing in the production and support of products...
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Laird Technologies Relocates Corporate Headquarters

Laird Technologies announced that effective immediately, Laird Technologies’ corporate headquarters has moved to a new location within the St. Louis, MO metropolitan area. This move occurred to provide additional space and updated facilities in response to the rapid growth of the company and the expected future growth. The new...
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Agilent Announces Productivity Breakthroughs with ADS 2008 EDA Software

Agilent Technologies Inc. announced Advanced Design System release 2008. Advanced Design System (ADS) is an industry-leading high-frequency, high-speed electronic design automation (EDA) software platform. This release contains productivity breakthroughs for faster communications product design. “Working closely with our top customers, we’ve enhanced this ADS release with user interface and...
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Ferro Forms Electronic Packaging Materials Business Unit

Ferro Corp. ’s Electronic Material Systems has combined several sub-business units into the newly-formed Electronic Packaging Materials (EPM) unit. The new EPM unit was formed to make it easier for customers to buy both performance-enhancing engineered formulations and cost-effective materials used to produce hybrid circuits, microelectronics, advanced packaging and...
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