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Industry News

Provigent Secures $16 M in Fourth Round

Provigent , a provider of System-on-a-Chip (SoC) solutions for the broadband wireless transmission market, announced that it has closed a fourth round of financing in the amount of $16 M. Globespan Capital Partners contributed funding to this round joining Provigent’s existing world-renowned technology investors: Sequoia Capital, Pitango Venture Capital,...
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Harris Completes Advanced EHF Navy Multi-band Terminal Testing

Harris Corp. has successfully completed the Advanced EHF Multi-band Terminal Prototype Testing (PT1) on its tri-band ship antenna and associated RF components five months ahead of schedule. Early completion of the PT1 testing ensures that compliant hardware will be available for system-level testing of the Navy Multi-band Terminal scheduled...
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Lockheed Martin Upgrades Missile Warning System

Lockheed Martin announced the successful delivery of a new missile warning system to address tactical and strategic missile threats against the United States and Canada. US Strategic Command, US Northern Command and North American Aerospace Defense commanders will rely on this upgraded technology to quickly and accurately identify threats...
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Raytheon Successfully Demonstrates Satellite Communications Alternative

During an exercise with the I Marine Expeditionary Force at Camp Pendleton, CA, Raytheon successfully demonstrated that a traditional, transportable satellite communications terminal could be field configured to communicate without acquiring a satellite connection. This capability, known as Troposcatter, or TROPO, transmits radio waves over the curvature of the...
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European Consortium Forges NFC Development

A pan-European consortium of companies, universities and user groups has been created to develop an open architecture for the development, deployment and use of Near Field Communication (NFC) enabled applications in mobile handsets. Co-funded by the European Commission and the Information Society Technologies (IST) programme, the Store Logistics and...
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Intelligent Move as Wavecom Joins ERTICO

Wavecom has joined the ERTICO alliance—a partnership of companies whose goal is to reinforce a future European transport system that is safer, more efficient, more sustainable and more secure. Through Intelligent Transport Systems (ITS) and Services technology, combined with the appropriate investment in infrastructure, the partnership’s efforts are aimed...
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aRfic Integrates R&D with NTU

n order to advance research and development in Radio Frequency Integrated Circuit (RFIC) technology, Advanced RFIC (aRfic) Pte Ltd. is investing $9 M in a new collaboration with Nanyang Technological University (NTU), Singapore. RFIC is a highly specialised segment of the semiconductor industry. It involves engineering design and development...
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NXP and ASE Join Forces in China

NXP Semiconductors and Advanced Semiconductor Engineering have signed a Memorandum of Understanding (MoU) to form a joint venture in Suzhou, China focused on semiconductor testing and packaging. It is planned that NXP will hold a 40 percent share whileASE will hold the remaining 60 percent. Terms of the agreement...
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EADS Commits to Singapore Aerospace Programme

European aerospace leader EADS is ramping up its Research and Technology (R&T) activities with Singaporean partners by signing a Memorandum of Understanding (MoU) with the country’s Agency for Science, Technology and Research (A*STAR) agency in its National Aerospace Programme. This MoU envisages a tier 1 membership for EADS in...
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