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Industry News

An ACE in the Pack for BAE

BAE Systems Advanced Technology Centre (ATC) has been selected to join the European Antenna Centre of Excellence (ACE) initiative, established to provide a European wide platform for research and development into the next generation of antenna technologies. The ACE initiative is funded to the order of €4.9 M under...
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Saab Ericsson Space Gets Landmark Order from Lockheed Martin

In what is considered to be a significant breakthrough, Saab Ericsson Space AB, Sweden, has received an order for Ku-band frequency converters for the JCSAT-10 payload from Lockheed Martin Commercial Space Systems, which will be delivered on a 12 month schedule. The converters are similar to those previously supplied...
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Cogent’s Tetrapol Wins NATO Support in Kabul

NATO forces in Afghanistan will soon benefit from enhanced communications following a contract award to Cogent Defence and Security Networks, the UK operating company of EADS Defence and Communications Systems Group. Under the contract the company will install a secure, trunked Tetrapol ISAF Command Network to provide command communications...
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TRL Technology Joins the Navy

UK-based radio and satellite communications systems specialist, TRL Technology Ltd., has supplied its turnkey Asset Tracking solution to the Royal Navy’s Maritime Warfare Centre, as part of an important trial initiative for blue force tracking. This builds on the company’s recent contract win to supply its advanced militarised asset...
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The Book End

Optical Fibers and RF: A Natural Combination Malcom Romeiser Noble Publishing 272 pages; $69 ISBN: 1-884932-45-2 The optical fiber industry has experienced a period of consolidation and reorganization and is now poised for a new surge in growth. Taking the approach that optical fibers are an extension of RF-based...
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Low Cost, High Performance Prepregs for PCB Cavity Designs

Two new Speedboard® prepregs have been introduced that are specifically designed to offer superior performance in applications involving cavity designs in multilayer printed circuit boards. These materials exhibit very low loss and low dielectric constant (Dk) to be compatible with high performance RF and microwave laminates. Many of today’s...
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A New Low Loss, Laser Ablatable Substrate for Microwave Circuitry

The use of polytetraflouroethylene (PTFE) as a dielectric substrate represents a mature technology in the field of RF/microwave circuit design. The growth in cellular communication infrastructure during the latter part of the twentieth century placed demands on laminated substrate manufacturers to develop both the capacity and products to make...
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High Frequency Circuit Materials to Meet the Needs of Today’s Complex Military and High Reliability Designs

The introduction of RT/duroid®6002 high frequency circuit material, manufactured by Rogers Corp. in the late 1980s, changed entirely what RF/microwave engineers could select for circuit board materials. Up until that time, designers seeking options of high frequency materials could select laminates with low or high dielectric constant, based on...
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Potential Applications of PBG Engineered Structures in Microwave Engineering: Part I

Electromagnetic bandgap (EBG) materials are periodic structures that exhibit wide bandpass and band rejection properties at microwave frequencies. Introducing periodic perturbations such as dielectric rods, holes and patterns in waveguides and PCB substrates forms photonic bandgap (PBG) materials. As in a photonic crystal (PC), photon propagation is impeded by...
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Design of a 3.5 W S-band Power Amplifier Based on Small-signal S-parameter Analysis

Large-signal device S-parameters are usually used in power amplifier (PA) designs to obtain the desired output power. The large-signal characteristics of a power transistor can be accurately extracted from load-pull measurements as described in the lit...
In the design of high frequency power amplifiers, the goal is to achieve the power gain and output power at the desired frequency in order to achieve high PAE. Large-signal S-parameters of power devices are normally not provided by the manufacturer. One of the methods to characterize the device...
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