Industry News

HVVi Semiconductors to Deliver Two Presentations

HVVi Semiconductors Inc. , a developer of silicon RF power transistors, will deliver two presentations at European Microwave Week, the leading conference in Europe for microwave, RF, wireless and radar technology. On Tuesday, October 28th, senior RF applications engineer Brian Battaglia will deliver a presentation on a revolutionary new...
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AWR and UMS Announce GaAs MMIC Design Incentive Program

AWR and United Monolithic Semiconductors (UMS) announced "Try the Power," an incentive program to allow new customers to bring gallium arsenide (GaAs) microwave monolithic integrated circuit (MMIC) design prototypes to market quickly and easily using AWR's Microwave Office electronic design automation (EDA) software and the UMS PPH25X foundry process...
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Agilent's System-level EDA Platform Reduces Design Time

Agilent Technologies Inc. introduced SystemVue 2008, a new electronic design automation (EDA) platform for electronic system-level (ESL) design. The new platform cuts physical layer (PHY) design time in half for high-performance communications algorithms and system architectures, for both wireless and aerospace/defense applications. The new SystemVue 2008 platform goes beyond...
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Gore Introduces Online Builder for UHD Interconnects

W.L. Gore & Associates (Gore) introduces an on-line builder for configuring GORE™ Ultra High Density (UHD) Interconnects to use in Bench Top Test Systems, Instrument Probe Cable, Parallel Data Link, Production Floor Equipment and Automated Test Equipment. GORE Ultra High Density (UHD) Interconnects provide an integrated system of board...
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