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AR Modular RF recently announced the completion of a new 50 W auto-tuning, multi-band tactical booster amplifier, designed to make it easy for troops to maintain constant, reliable communications in even the worst environments. The new AR-50 booster amplifier boosts tactical radio signals from handheld and back-pack transceivers operating...

The power of one multi-intelligence aircraft collecting, correlating then distributing diverse types of intelligence to those who needed it was demonstrated by Lockheed Martin during the US Army's C4ISR On-The-Move exercise. Lockheed Martin’s Airborne Multi-intelligence Laboratory (AML) demonstrated how its onboard sensors, interacting with the Army’s intelligence and battle...

Anritsu Co. , a global leader in LTE test solutions, introduces a comprehensive LTE base station measurement suite that allows field engineers and technicians to conduct tests necessary for the proper deployment, installation and operation of LTE networks. The measurement suite is a set of optional measurement capabilities for...

The Advanced Circuit Materials (ACM) Division of Rogers Corp. has introduced RO4360™ laminates, developed for the special requirements of high-frequency amplifier designers. RO4360 laminates feature a dielectric constant of 6.15 and loss of 0.003 at 2.5 GHz. The laminates are based on a ceramic-filled, thermoset resin system reinforced by...

Vendors will ship $4 B in Wi-Fi radio chips in 2013, most of these for cellphones, notebooks, netbooks, infrastructure, home entertainment systems and wireless gaming consoles. At the same time, adoption of 802.11n MIMO with multiple transmit streams will help boost the market for Wi-Fi power amplifier modules to...

DENSO Corp. , Freescale Semiconductor and TRW Automotive Holdings Corp. have joined together to form an industry consortium to drive further development and deployment of the Distributed Systems Interface (DSI) standard. DSI is the automotive industry’s most widely adopted bus standard used to connect remotely placed sensors to the...

Avago Technologies , a supplier of analog interface components for communications, industrial and consumer applications, announced a pair of dual-band power amplifier modules (PAM) for handset applications that operate in UMTS Bands 1+8 and 2+5. Housed in a 4 mm by 5mm form factor, 14-pin surface-mount package, the ACPM-7355/7357...

The Advanced Circuit Materials (ACM) Division of Rogers Corp. recently introduced its RO3730™ laminates, tailored for the special needs of high-frequency antenna designers requiring cost-effective PTFE laminates. These ceramic-filled laminate materials are reinforced by woven fiber glass with optimized glass and filler loading for excellent structural stability and outstanding...

A new version of a European Standard published by the European Telecommunications Standards Institute (ETSI) promises significantly increased broadband capacity to meet the ever-growing demands foreseen for European communications. The latest version of the standard, which is known as ETSI Harmonized Standard EN 302 217-3 – Fixed Radio Systems;...

NEC Corp. , a provider of microwave and next generation transport solutions, has launched a new wireless and photonic solution for convergent mobile backhaul. Designed to bring the benefits of WDM technology to legacy and Ethernet transport equipment, the solution features the company’s smart microwave aggregation node (PASOLINK NEO...