Industry News

Remtec Has Developed Innovative Flip Chip Packaging

Remtec , a leader in ceramic packages based on Plated Copper on Thick Film (PCTF) technology, has developed an efficient, cost effective chip scale packaging approach for flip chip power devices. It allows for simple, effective packaging of various Si, SiC and GaN FET transistors -- MOSFETs and eGAN...
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RFMD Expands Broadband Product Portfolio with Differential Amplifiers for CATV Networks

RF Micro Devices Inc. announced the introduction of a new product family of high performance differential amplifiers for cable television (CATV) networks. The broadband CATV products leverage RFMD's product and technology leadership to deliver enhanced functionality and improved performance to CATV access networks worldwide. Specifically, RFMD's newest broadband CATV...
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Agilent Enhances VEE Test and Measurement Software

Agilent Technologies Inc. introduced the enhanced version of Agilent VEE, an interactive graphical programming application for test and measurement. Enhancements include greater compatibility with the latest Agilent instruments, faster data analysis and a more versatile user experience. Agilent VEE 9.3 provides new sample programs with simple VEE programming for...
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Guzik Introduces AXIe-based Digitizer Module

Guzik has developed the ADC 6000 series AXIe-based Digital Acquisition and Processing Module combines high-speed waveform digitizer with built-in digital signal processing hardware, which enables mixed-domain signal capture and analysis with high-speed data transfer link to a computer. The ADC 6000 Module comes in a space-saving display-less 1U 19”...
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