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RF Micro Devices Inc. announced it will showcase its broad portfolio of products and technologies for the wireless and wired broadband markets at the upcoming IEEE International Microwave Symposium (IMS), held June 17-22, in booth 1210 at the Palais des congres Montreal, Canada.
Mercury Computer Systems Inc. (www.mc.com), a trusted provider of commercially developed application-ready ISR and EW subsystems for defense prime contractors, announced that it has signed a definitive agreement to acquire Micronetics Inc. (www.micronetics.com), a leading designer and manufacturer of microwave and radio frequency (RF) subsystems and components for defense and commercial customers.
Advantech Wireless, a Canadian-based manufacturer of satellite, RF equipment and microwave systems, will present details of its world leading, state-of-the-art Solid State Power Amplifiers (SSPAs) featuring GaN technology at CommunicAsia 2012 Show.
Peregrine Semiconductor Corp. (Peregrine), a leading provider of high-performance radio-frequency (RF) integrated circuits (ICs) announced that the U.S. International Trade Commission (ITC) has launched an investigation into whether RF Micro Devices Inc. (RFMD) products infringe certain Peregrine patents relating to RF ICs and switch technology. The action and investigation further include Motorola Mobility Inc. and HTC Corp. (HTC), whose products incorporate the alleged infringing RF ICs.
Cadence Design Systems, Inc. and Samsung Electronics have collaborated to deliver a 20 nanometer design methodology that incorporates double patterning technology for joint customer deployment and internal test chips. The collaboration brings new process advances for mobile consumer electronics, enabling design at 20 nm and future process nodes.
According to Ericsson, 85 percent of the world's population will have internet coverage via 3G by 2017 and there will be close to nine billion mobile subscriptions, compared to six billion by the end of 2011.
Providence-based marketing communications agency Sheppard Leger Nowak Inc. (SLN) is teaming up with Transline Technology Inc. (TTI) of Anaheim, CA at the 2012 IEEE International Symposium coming up in Montreal, Canada on June 19-21 for a three-day series of fun challenges that will have lucky winners taking home some very cool electronic equipment prizes.
EMC Technology has introduced another cost effective solution for temperature compensation in an SMT planar style, the AN11 series. This ultra mini Thermopad® offers the smallest 0402 package size for temperature variable attenuators in the industry. The AN11 series is perfect for hand held devices and instruments, pico base stations and more. With excellent frequency response from DC to 6 GHz the AN11 series handles 100mW of input power, requires no bias or control voltages and generates zero distortion.
Plextek (www.plextek.com), a leading designer of custom ICs operating at microwave and mm-wave frequencies, will be presenting details of a low cost, SMT packaged, 6 to 18GHz, 0.5W amplifier integrated circuit (IC) at the International Microwave Symposium, the world’s largest microwave conference and exhibition.
Researchers at MIT have found a new way of making complex three-dimensional structures using self-assembling polymer materials that form tiny wires and junctions. The work has the potential to usher in a new generation of microchips and other devices made up of submicroscopic features.
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According to Ericsson, 85 percent of the world's population will have internet coverage via 3G by 2017 and there will be close to nine billion mobile subscriptions, compared to six billion by the end of 2011.