Industry News

Latest Freescale Airfast RF power solutions deliver new levels of performance

RF power market leader Freescale Semiconductor has introduced new Airfast™ transistors engineered to boost the efficiency, peak power and signal bandwidth of next-generation base stations. With the new offerings, Freescale’s flagship Airfast RF power product line now includes at least one solution for each cellular band and supports both small and large cell base station deployments.


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KCB introduces new concepts in semiconductor packaging at IMS

In IMS booth #3513 in Montreal, Canada this week, KCB, an AS-9100 certified designer and manufacturer of hi-rel SMT devices, is introducing some of their most recent semiconductor packaging techniques. One such technique, recently employed for a military customer in the AESA radar market, was a custom hermetic device that included two chips, a driver, on-board DPS, a DVA capability, and a PA stage.


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RFMD introduces WiFi front end modules at IMS 2012

RF Micro Devices Inc. announced the release of four high-performance front end modules (FEMs) for next generation WiFi applications. The RFMD® RFFM8200, RFFM8500, RFFM8202, and RFFM8502 are highly integrated FEM solutions covering multiple WiFi standards and frequency bands, particularly IEEE802.11n and the emerging 802.11ac specification. RFMD's FEMs achieve industry-leading linear power and dynamic error vector magnitude (EVM) performance in support of the newest reference designs from the world's leading WiFi chipset providers.


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