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MITEQ has announced that the company’s president, Howard Hausman will deliver a 40 minute workshop at EDI CON 2013 titled, “Applications of Fiber Optic Links in RF and Microwave Systems” to the audience of RF, microwave and high speed digital designers attending this premier event in Beijing, China.
The Wireless Gigabit (WiGig) Alliance has completed testing its multi-gigabit wireless WiGig technology at the first plugfest since a “memorandum of understanding” of unification with Wi-Fi Alliance® was executed late last month.
Mentor Graphics announced the new release of its HyperLynx® product featuring advanced 3D channel and trace modeling, improved DDR signoff verification, and accelerated simulation performance.
Aeroflex Ltd., a wholly owned subsidiary of Aeroflex Holding Corp., announced that the Aeroflex E500 LTE Capacity Test System is the industry's first capacity tester to successfully hand over data services between TDD and FDD networks.
Linear Technology announces the LTC6090, a precision operational amplifier that operates on a supply voltage up to 140 V (or ±70 V). Its combination of rail-to-rail output, 3 pA (typical) input bias current, 1.6 mV maximum input offset voltage and 3.5 µVP-P low frequency noise delivers the precision required for high performance ATE, piezo driver, and DAC buffer applications.
AR Europe is proud to announce its new exclusive distribution agreement with Eastern Optx, a New Jersey based company that designs and manufactures fibre optical delay systems. This new product line includes radar target simulation systems, radio altimeter test sets and channel replicators.
Photo Stencil LLC, a leading full-service provider of high-performance stencils and tooling, will present the papers, Printing and Assembly Challenges for QFN Devices and Two Print Stencils Process at IPC APEX 2013. Videos of the presenters describing these papers can be found at www.photostencil.com/apex2013.php.
Molex Inc. introduces high density iPass+™ zHD vertical connectors for midplane or other non-edge-board applications. The new iPass+ zHD vertical connector system provides a 0.75vmm pitch vertical connector that meets requirements of SAS-3 and projected SAS-4 bandwidths.
UBM Tech, whose portfolio includes essential business and technical information for design engineers and the electronics industry, announced the 2013 DesignVision Award winners, including industry firms Mentor Graphics, TE Connectivity, ANSYS Inc., Upverter, MicroSemi, Teledyne LeCroy and Averna.
Pulse Electronics Corp., a leading provider of electronic components, introduces RF MoCA (Multimedia over Cable Alliance) filter modules that are pin-in-paste compatible. Pin-in-paste manufacturing uses a reflow instead of a wave soldering process to apply solder to the components, saving time, increasing throughput, and reducing costs. These filters are compliant with MoCA 1.1 and 2.0 requirements and are qualified with leading MoCA silicon vendors.
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Mentor Graphics announced the new release of its HyperLynx® product featuring advanced 3D channel and trace modeling, improved DDR signoff verification, and accelerated simulation performance.