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Thales and Vinghøg AS signed a contract for the delivery of 44 Squire battlefield surveillance radars, to be deployed by the Norwegian Armed Forces. The first 10 systems will be delivered in the second half of 2013. The last delivery is scheduled for beginning of 2017.

ABI Research forecasts 8.6 billion smart cards will ship in 2013; a combined number spanning all smart card markets. Of total shipments, 16 percent are forecasted to use a contactless interface, rising to 30 percent in 2018. Government ID, transportation and ticketing, and payment cards continue strong double-digit growth in contactless adoption.

Azimuth Systems Inc., a provider of automated, real-world mobile performance test solutions, announced the availability of its Device Automation & Control (DAC) system, enabling unattended execution of user experience testing on smartphones and other mobile devices. DAC was developed to address the requirements of both lab- and field-based test organizations, providing a common tool set and methodology across test environments.

NEC Corp. has introduced a new wireless outdoor unit (ODU) to its existing iPASOLINK split-mount microwave communications system.

Tele2 has signed a frame agreement with Ericsson for the expansion and upgrade of its mobile backhaul network throughout Europe.

Saab has partnered with Tawazun to create Abu Dhabi Advanced Radar Systems – a new UAE-based radar company.

Rosenberger has started operations in the company’s new EMC laboratory in Fridolfing, Germany. Centrepiece of the new lab is an anechoic chamber for EMI emission measurements at component level.

The Navy's Aegis Ballistic Missile Defense System scored another hit for the Missile Defense Agency on the Pacific Missile Range, marking the first live-fire intercept of a medium-range ballistic missile using space-based sensors.

Agilent Technologies Inc. introduced compliance testing support for Energy-Efficient Ethernet (EEE) standards used in networking applications. Agilent’s solution for transmitter tests includes 10BASE-T, 100BASE-T and 1000BASE-T EEE test standards as described in the IEEE 802.3az-2010 specification.

UltraSource Inc., a thin film ceramic microchip manufacturer is pleased to announce that the company now offer a cost effective backside treatment process to all customers wishing to attach thin film components with epoxies and improve the adhesion and reliability of bonding.