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Lake Shore announces a new continuously variable temperature (CVT) probe, developed in collaboration with TOYO Corp., that allows for true, continuous unattended wafer probing of a material sample across a range of temperatures. The probes, when used in any Lake Shore probe station, significantly improve reliability of sample measurement.
Nujira Ltd., the world leader in Envelope Tracking (ET) technology, has celebrated the opening of the 2013 Mobile World Congress in Barcelona by announcing that it has passed the 200 patent mark. Nujira has the most extensive ET IPR portfolio in the industry and this latest milestone demonstrates Nujira’s continuing innovation in developing ET for use in modern digital communications.
TI announced two new software packages for its KeyStone-based multicore system-on-chips (SoCs): a new production ready small cell Physical (PHY) software package and a transport software package for wireless and other network-oriented applications.
Rohde & Schwarz has tailored its mid-range measuring instruments to handle WLAN signals in line with IEEE 802.11ac. Using the R&S SMBV100A and R&S FSV, manufacturers of WLAN chipsets, components and devices can now easily generate and analyze signals with 160 MHz bandwidth.
Aeroflex Ltd., a wholly owned subsidiary of Aeroflex Holding Corp. announced that the 7100 Digital Radio Test Set has added support for carrier aggregation, a key component of LTE-Advanced (LTE-A).
Pulse Electronics Corp., a provider of electronic components, announces that it has developed a tunable, co-located long term evolution (LTE) antenna structure. The developed structure contains two LTE multiple input, multiple output (MIMO) antennas in the same end of one device to provide 9 frequency bands of functionality in a volume of just 3.20 cubic centimeters.
Peregrine Semiconductor Corp., a fabless provider of high-performance radio frequency integrated circuits (RFICs), announced from Mobile World Congress in Barcelona it has expanded its DuNE™ Digitally Tunable Capacitor (DTC) product line with six second-generation devices for antenna tuning in 4G LTE smartphones.
RF Micro Devices Inc. announced the expansion of the company's family of multimode multi-band (MMMB) power amplifiers (PA) to include the highly integrated RF7388 3G/4G MMMB PA.
Of all the available backhaul choices for LTE macrocells and small cells, by 2018, sub 6GHz OFDM NLOS technology will become the most popular for “last mile” backhaul. Fiber-based backhaul will be the second most popular choice, where it is available, followed by millimeter wave and the traditional LOS microwave links.
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TI announced two new software packages for its KeyStone-based multicore system-on-chips (SoCs): a new production ready small cell Physical (PHY) software package and a transport software package for wireless and other network-oriented applications.
Aeroflex Ltd., a wholly owned subsidiary of Aeroflex Holding Corp. announced that the 7100 Digital Radio Test Set has added support for carrier aggregation, a key component of LTE-Advanced (LTE-A).