Industry News

Fulbright-Nokia Announces Distinguished Chair

Nokia Foundation and the Fulbright Center have announced the creation of a new Fulbright-Nokia Distinguished Chair. The initiative will support American scholars in Information and Communications Technologies to lecture in Finnish Universities. The first recipient is expected in Finland for the academic year 2010-2011. The Nokia Foundation was formed...
Read More

SUSS and 3M Form 3-D Packaging Bond

3M and SUSS MicroTec have agreed to expand access to 3M Wafer Support System (WSS) equipment for temporary wafer bonding of ultra-thin wafers required for 3-D packaging. As part of this non-exclusive agreement, SUSS MicroTec becomes an authorized equipment supplier for the 3M WSS and will manufacture and sell...
Read More

RFMD Announces Availability of GaN Foundry Services

RF Micro Devices Inc. (RFMD), a leader in the design and manufacture of high performance semiconductor components, announced the company has formed a gallium nitride (GaN) Foundry Services business unit to supply high reliability, high performance and price-competitive GaN semiconductor technology into multiple RF power markets. The RFMD GaN...
Read More

Lockheed Martin Selects M2 Global

Lockheed Martin has entered into a US Department of Defense Mentor-Protégé Agreement with M2 Global Technology Ltd. San Antonio, TX, a small business supplier to Lockheed Martin’s F-16, F-22 and F-35 programs. Over the one-year period of the Mentor-Protégé relationship, Lockheed Martin Aeronautics will assist and guide M2 Global,...
Read More

EADS DS Takes Up International Sentry Duty

CalAmp Corp. has entered into an exclusive agreement with EADS Defence & Security (EADS DS) to supply a customised version of its WiMAX-based Sentry 4G™ Wireless IP Router, a new rugged broadband communications and networking platform for mission critical broadband communication applications. The custom high power mobile data terminal...
Read More