Industry News

RSS

Elisra , a leader in EW and wireless communication technologies, unveils its newly developed UAV data link systems at AUVSI’s Unmanned Systems North America 2009 Conference and Exhibition in Washington, DC, August 11-13. The company’s latest C-band Starlink and ADLS-2 solutions will be showcased, underscoring Elisra’s technological prowess in...

Radio Waves Inc. has announced the availability of a new LPA Antenna, the LPA-1-18. This Log Periodic Dipole Array antenna is broad banded in nature and operates from 1 to 18 GHz in a single antenna. This antenna is a directive array similar to a yagi, but covering a...

Anritsu Co. introduces the MT8855A, an integrated test set capable of measuring the new generation of products using the Bluetooth Advanced Audio Distribution Profile (A2DP), headset profile and hands-free profile. Providing frequency coverage of 20 Hz to 20 kHz, the MT8855A offers lower cost-of-test, significantly reduced development time, and...

Skyworks introduces two new varactor diodes for use in diverse applications such as mobile handset-based DTV receivers, FM tuners and low phase noise voltage-controlled oscillators. Available from stock, these new diodes offer high breakdown voltage, enabling tuning as high as 28 V. In addition, these Pb-free packaging devices offer...

The importance of capacity building, global standards for emerging technologies, and broadband access to spur development in under-served communities were the key themes at the International Telecommunication Union (ITU) Regional Development Forum (RDF) for the Asia-Pacific Region on Next Generation Networks and Broadband: Opportunities and Challenges. The RDF, which...

CEITEC S.A. , a Brazilian company focused on the development and production of application specific integrated circuits (ASIC), has opened Latin America’s first IC design center. The company will add 60 engineers to its ranks who will design RFID, digital media and wireless communication chips for its fabrication facility...

Using CST MICROWAVE STUDIO® (CST MWS) iii, Americo Dominicis of Selex-SI in collaboration with Professor A. Orlandi of the University of L’Aquila investigated the impact of a lightning strike on a mobile 3D radar. The application of 3D simulation to this complex problem resulted in a better understanding of...

IMEC will use SUSS MicroTec 's XBC300 production wafer bonder platform to develop 200 and 300 mm permanent metallic interconnect bonding, as well as temporary bonding and debonding solutions for its 3D-stacked interconnect and 3D wafer level packaging technology. This universal platform can support a wide range of materials...

MI Technologies , a provider of advanced engineering, wireless, precision instrumentation and measurement systems, announced it has entered into an agreement to purchase the majority of the assets and have exclusive rights to all IAM System’s designs and products. Since its inception, IAM Systems has been a designer and...

Anritsu Co. announced a partnership with Forward Link , a division of CBM of America Inc. (CBMA) and a recognized leader in the design, engineering, manufacturing and integration of innovative products and services for the communications industry. The partnership will enhance Anritsu’s established position as the market leader in...