Industry News

EDI CON USA 2017 Announces Short Courses

Opening day of the conference features in-depth training with three-hour short courses on RF, microwave and high-speed digital design.

The Electronic Design Innovation Conference and Exhibition (EDI CON) USA, the first industry event to bring together RF/microwave and high-speed digital design engineers and system integrators, announced the addition of a full day of training to its conference program at the Hynes Convention Center, September 11-13 in Boston, Mass.

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AFFOA Opens $10M HQ, Unveils Two Advanced Fabric Product Platforms

MIT and the Commonwealth of Massachusetts provided major funding for the $10 million facility, located at 12 Emily Street, near the MIT campus. The Fabric Discovery Center (FDC) which will feature end-to-end prototyping, start-up incubation space and education and workforce development activities is part of a nationwide effort dedicated to the acceleration of U.S. textile manufacturing through a high-tech, value-added domestic ecosystem.

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UT Horizon Fund Invests in GenXComm to Full Duplex Technology

GenXComm closed a fully-subscribed round of seed financing, with investments from the UT Horizon Fund and other investors. GenXComm says their "robust, simultaneous, self-interference cancellation (S-SIX) technology unleashes the full potential of the spectrum used for today’s 5G mobile, Wi-Fi and cable networks by allowing channels to be stacked one next to the other with no empty spectrum between them."

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