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Lockheed Martin will begin managing the transformation of the Department of Defense’s global data network, known as the Global Information Grid. The determination on this Defense Information Systems Agency (DISA) contract was made by the Government Accountability Office after a protest by a competing bidder.

Communications & Power Industries LLC (CPI) has received initial orders totaling more than $5 million from a prime contractor for high-power, Ka-Band satellite communications amplifiers. These satcom amplifiers will be used in a U.S. military communications program intended to provide worldwide communications connectivity to tactically deployed forces.

Aeroflex Ltd. has added support for 4x2 multi-input multi-output (MIMO) to the 7100 Digital Radio Test Set for the R&D testing of LTE user equipment (UE) being designed with this feature.

BAE Systems received a $31.8 million foreign military sale contract to produce eight M88A2 Heavy Equipment Recovery Combat Utility Lift Evacuation Systems (HERCULES) for the Iraqi Army. 

API Technologies Corp., a trusted provider of RF/microwave, microelectronics, and security solutions for critical and high-reliability applications, announced that it will showcase its complete breadth of engineering and manufacturing capabilities during the AUSA 2012 Annual Meeting & Exposition.

Lockheed Martin has been awarded three new contracts to support the supply chain needs of the Republic of Korea Air Force and Navy.

Harris Corp. has received a $297 million Indefinite Delivery/Indefinite Quantity (IDIQ) contract to deliver Falcon® tactical radio systems to the U.S. Department of the Navy.

Richardson RFPD Inc. announces immediate availability and full design support capabilities for three new devices from Freescale Semiconductor Inc. (Freescale).

Raytheon Co. received a $349 million five-year, multi-year contract to provide heavy anti-tank, wireless precision-assault missiles for the U.S. government. Raytheon received the award during its third quarter.

The market for mobile handset IC, including platform and connectivity ICs, surpassed $32 billion in 2011 and is forecast to grow a further 11 percent in 2012 to reach $35.7 billion. Growth is being led largely by the smartphone segment, with ultra-low end handsets also growing strongly. “Qualcomm stands out as the market leader with 26 percent overall share in 2011,” stated Peter Cooney practice director, of semiconductors,  “its continuing focus on the handset market and in particular its efforts to increase platform integration look set to further strengthen Qualcomm’s hold on the market in the near term.”