Industry News

Sonnet Introduces Sonnet Suites Release V12

Sonnet Software Inc. races into multi-threaded computing technology with its latest software, Sonnet Suites Release 12 (V12), which allows designers to analyze circuits up to 30 times faster than the previous release. Two new versions of Sonnet’s Electromagnetic analysis engine, em®, are launched in V12: Sonnet Desktop Solver engine,...
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Avago Expands Miniature PCS FBAR Band Duplexers

Avago Technologies , a supplier of analog interface components for communications, industrial and consumer applications, announced the addition of an environmentally ‘green’ PCS FBAR Band Duplexer to its series of miniature duplexers. The ACMD-7409 duplexer, which was designed using Avago’s own FBAR technology, targets designers of PCS handsets, and...
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IMS 2009 Front End Products

Below are some of the new switches, filters, duplexers, dividers and other front end products being highlighted at IMS 2009 including some exciting new tunable technologies: Trilithic Inc. released a small footprint diplexer for the DC to 2000 MHz band. Featuring low pass rejections of 60 dB minimum from...
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Aeroflex/Inmet Highlights 12 GHz Pulsed Bias Tee

Aeroflex/Inmet announces a new, 12 GHz Pulsed Bias Tee. When the introduction of a high frequency control signal is needed, the optimized DC bandwidth allows for use in high frequency baseband, switching and modulation applications. Designed for both the lab environment and field use, this rugged pulsed bias tee...
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Trilithic Releases New Series of Broadband Power Dividers

Trilithic Inc. has released a new series of broadband power dividers featuring frequencies from 2 to 18 GHz. These compact Wilkinson designs use single or multistage designs that include 2-way, 4-way and 8-way configurations. The octave band models feature low insertion loss and high port-port isolation, typically > 20...
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HIRAI Features 2D/3D Hybrid Fabrication Technology

HIRAI LTCC foundry service provides its featured 2D/3D hybrid fabrication technology for high Q multi-layered substrates of micro- and millimeter-wave applications. Exhibited are the millimeter-wave module that integrates a slot array antenna, a hollow layer underneath, a post-wall waveguide and an aperture coupled waveguide-to-microstrip line transition, presently under development...
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