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SELEX Galileo is using Plextek 's EPAC embedded processing and communications platform in its CISP communications technology, which is a key element in the Sensing & Autonomous Tactical Urban Reconnaissance Network (SATURN) solution. SATURN employs unmanned aerial and ground vehicles each fitted with sensors to report findings back to...

Rohde & Schwarz China and Signalion have closed a distribution agreement for Signalion’s LTE User Equipment (UE) simulator for base station (eNB) test in China. As part of the agreement, Rohde & Schwarz China will also be responsible for technical support as well as maintenance and repair of Signalion’s...

SMITHS Group , the global technology company, has opened its new headquarters in central London, completing a reorganization designed to increase customer focus and significantly cut costs. Corporate and top divisional management had been based in a 65,000 ft 2 building on Finchley Road, London, UK, for almost 30...

Wavesat Inc. , a supplier of broadband wireless semiconductor solutions, announced the company has secured its latest round of funding, raising $11.7 M CAD. Existing investors led by BDR Capital, BDC Capital and Multiple Capital participated in the round. Proceeds will be used to further strengthen the company’s leadership...

The trend of miniaturization in electronic components is a given, as it is well documented that consumers want smaller, lighter electronic products with more functionality. This is achieved by either making components on the board physically smaller, using undertab terminations, or by modifying the design to reduce the number...

For this discussion we will differentiate Multi-chip modules (MCM) as essentially dozens of chips interconnected on a small form factor single layer substrate, System-in-Package (SiP) being the 3D chip stacking of bare or packaged chips on a multi-layer substrate and the System-on-Package (SoP) as similar to the SiP with...

For this discussion we will differentiate Multi-chip modules (MCM) as essentially dozens of chips interconnected on a small form factor single layer substrate, System-in-Package (SiP) being the 3D chip stacking of bare or packaged chips on a multi-layer substrate and the System-on-Package (SoP) as similar to the SiP with...

For this discussion we will differentiate Multi-chip modules (MCM) as essentially dozens of chips interconnected on a small form factor single layer substrate, System-in-Package (SiP) being the 3D chip stacking of bare or packaged chips on a multi-layer substrate and the System-on-Package (SoP) as similar to the SiP with...

Call me an optimist. Despite the current recession and concern about business prospects for at least the first half of 2009, I believe the microwave industry will persevere and become stronger. The proliferation of communication systems in our personal and professional lives gives me confidence that the demand for...

Much of today’s R&D in high-frequency electronics is concerned with squeezing more functionality into a smaller package at an affordable price. While large, complex ICs known as System-on-Chip (SoC) are the choice when production volume is high, multi-chip integration often wins for lower volume and speedier time-to-market. The multi-chip...