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AWR Corp. announces that it has added Taiwan to the list of cities scheduled for the July 2012 tour of the AWR Design Forum (ADF) 2012. The Taiwan event will take place on Thursday, July 12. 

Rogers Corp. and representatives of its Advanced Circuit Materials Division will be at the upcoming 2012 IEEE International Microwave Symposium (IMS) to help attendees learn more about Rogers’ wide range of high frequency circuit materials.

RF Micro Devices, Inc., a global leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies, announced that company executives are scheduled to present at the 2012 Stephens Inc. Spring Investment Conference in New York, NY on Wednesday, June 6, 2012, at 9:00 a.m. Eastern Time.

Agilent Technologies Inc. announced its Bluetooth low-energy test solution on the N4010A wireless connectivity test set was verified by Texas Instruments Inc. for use with TI’s integrated circuits in Bluetooth Smart and Smart-Ready devices. The Bluetooth low-energy Tx/Rx test capability on N4010A gives manufacturers and design houses reliable and efficient test solutions for single-mode and dual-mode devices.

Visit Renaissance Electronics Corporation/HXI at the IMS MTT-S 2012 tradeshow in Montreal, Canada, from June 19 - 21, Booth #500.

ANADIGICS, Inc. announced that Tim Laverick has joined the company as vice president, infrastructure products, and Robert Bayruns has been appointed vice president and chief technology officer. Laverick is a business and engineering leader with over 20 years of experience in the RF and Microwave semiconductor industry and Bayruns has over 30 years of leadership and engineering experience. 

Polaris Wireless announced a significant contract for a multi-million dollar deployment of the Polaris Wireless Altus and OmniLocate location surveillance product suite in the EMEA region.

Hesse & Knipps GmbH, European headquarters of Hesse & Knipps Semiconductor Equipment GmbH and sister company to Americas subsidiary Hesse & Knipps, Inc., will discuss “Wedge Bonding for Chip-On-Board and Direct-Chip-Attach Applications” at the rescheduled SMTA Philadelphia Chapter Meeting now on June 12th at 4:30 p.m. at the Air Products in Allentown, PA.

Teledyne Technologies and LeCroy Corp. have entered into a definitive agreement that provides for the merger of LeCroy Corp. with a wholly-owned subsidiary of Teledyne.

ANSYS Inc., a global innovator of simulation, and Esterel Technologies S.A. ("Esterel") a leading provider of embedded software simulation solutions for mission critical applications, announced that they signed a definitive agreement whereby ANSYS will acquire Esterel Technologies for a cash purchase price of approximately euro 42 million (or approximately US$53 million), subject to certain working capital adjustments at close.