To continue showcasing the growth of the SOI ecosystem and the application drivers for ultra-low-power IC solutions, the SOI Industry Consortium has organized a two-day event for information-sharing, networking and RF and analog design in Silicon Valley on April 26-27.
W. L. Gore & Associates Inc. (Gore) is pleased to announce that GORE® Microwave/RF Assemblies, 7 Series have been selected for use in commercial aircraft to deliver continuous high quality signals for improved Wi-Fi Internet access on European short-haul flights.
KEMET has expanded its electrostatic discharge (ESD) rated ceramic capacitor series into a complete product portfolio. Automotive and commercial grades are now available in EIA 0402, 0603, 0805 and 1206 case sizes with voltage ratings of 16 to 250 VDC.
Microsemi Corporation announced completion of certification of its portfolio of cesium clocks to be compliant with the new G.811.1 recommendation (known as enhanced Primary Reference Clocks, or ePRC) from the International Telecommunication Union (ITU) for timing characteristics of enhanced primary reference clocks.
Integrated Device Technology Inc. (IDT) announced that its latest wireless charging transmitter and receiver chipset is used in the Xiaomi Mobile flagship smartphone MI MIX 2S and wireless charging pad for easy and convenient charging.