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Harris Corp. has been awarded an IDIQ contract with a potential total value of $400 million to provide the U.S. Special Operations Command with next-generation communication capabilities.

Visit Microwave Journal's Online Show Daily page for the IEEE MTT-S International Microwave Symposium 2012 in Montreal for the latest coverage of the show and conference.

Rogers Corp. will be offering a wide range of its high performance circuit board materials at the upcoming Del Mar Electronics & Design Show on May 2-3, 2012 at the Del Mar Fairgrounds in San Diego, CA. Representatives from Rogers Advanced Circuit Materials Division will be available at Booth #622 to help visitors obtain optimum performance using the company’s many different circuit board material offerings.

Auriga Microwave announces the promotion of Dr. Nickolas Kingsley to Director of Engineering. Dr. Kingsley will assume responsibility for managing Auriga’s RF/microwave engineering team while Dr. Yusuke Tajima, Auriga’s CTO, will focus on driving Auriga to the elite heights of GaN- and GaAs-based RF microwave front ends. 

Teseq Inc., a leading developer and provider of instrumentation and systems for EMC emission and immunity testing, announced it has hired Michael Yantz as its new Vice President of Business Development. Yantz, who is a veteran in the EMC testing industry, will focus on cultivating new North American and international sales channels and opportunities for Teseq while expanding the company’s reach into new markets.

Wireless connectivity ICs totaled more than $8 billion in 2011 and will produce revenues close to $40 billion for Bluetooth, Wi-Fi, NFC, GPS, and combo ICs through 2016.

Agilent announced the industry’s most advanced PC-based oscilloscope analysis software, which allows engineers to analyze previously captured signals from oscilloscopes made by Agilent and other vendors.

Four new MMIC Upconverter and Downconverter devices from RFMD offer high performance and low cost for high frequency applications. The RFUV1002 and RFUV1003 Upconverters incorporate an image rejection mixer, LO buffer amplifier, variable gain amplifier, and DC-decoupling capacitor. The RFRX1001 and RFRX1002 Downconverters incorporate an image rejection mixer, LO buffer amplifier, integrated LNA, and DC-decoupling capacitor. Each device is packaged in a 5 x 5 mm QFN to simplify both system-level board design and volume assembly.

Mobile handset semiconductors, including processors, RF, power management, and wireless connectivity, grew to more than $30 billion in 2011. The worldwide market generated more than $120 billion in revenue over the last five years and will generate more than $170 billion during the next five years.

To improve reliability and performance in telecommunication equipment, W. L. Gore & Associates has advanced its portfolio of products and services that enable the industry to remain connected and protected. In addition to introducing its new business unit that focuses on mobile devices, Gore is displaying new venting products, cooling filters, and testing methods to enable manufacturers and suppliers of wireless headsets, small cell devices, base stations and other telecommunication infrastructure to improve product performance for their customers.