Microwave Journal

Hirai SK Corp.

M. Fujimoto of Hirai SK Corp. talks about his company's LTCC foundry service, how they offer higher Q, higher dimensional precision and higher yield for RF and millimeter-wave applications and what they will be showing this year at EuMW.

October 7, 2008

M. Fujimoto of Hirai SK Corp., a foundry service of multi-layered Low-Temperature Ceramic Co-fire (LTCC) substrates that targets higher Q, higher dimensional precision and higher yield for RF and millimeter-wave applications, was pleased to announce a number of items that his company will be presenting at European Microwave Week 2008 in Amsterdam later this month. Product-wise they will be presenting their new hermetically-sealed LTCC package for micro- and mm-wave applications. The product offers lower loss and a smaller footprint by virtue of the novel concept of multi-strip resonators as well as high Q due to the hybrid use of 2D and 3D configuration of the material. This product should be of interest to manufacturers of mobile phones, especially 4G, and every portable/wireless equipment manufacturer who desires less power consumption and miniaturization of the RF section of their design, in addition to companies who are interested in the design of the micro- and mm-wave design of the modules and in emerging mm-wave technology and applications.

Our company specializes in LTCC foundry services, including precise process technology, in-house plating of the LTCC and short time delivery of samples (usually in just a week). RF design support is provided by our design library located on the web http://www.hirai.co.jp/ceramic_e.html and our RF inspection test services up to 67 GHz. Our special relationship with our customers is exemplified by our partnership development, that is, to think, design and optimize together with the customers on their overall modules, antennas, antenna+FEM or systems instead of just the design of the substrate. To consider the return in a longer term especially for the above partnership order and, as stated above, provided a one week + international transportation (approximately three days or so) delivery of samples (in case where the configuration is not too complicated or specialized), we are able to help our customer save time and money.

The company will also be presenting a technical paper (presented in the poster session, EuMCPoster04-3, by Prof. Awai, Ryukoku University, et al.) on an LTCC Bandpass Filter with a Novel Multi-strip Resonator.

LTCC Technology Office was created in HIRAI SK in January of 2007 and five engineers are engaged in LTCC development focusing on the RF applications of the LTCC multi-layered module substrates and the company is expecting that the LTCC becomes the second main business next to the present main business: metal etching. Those who are interested in the design of micro- or mm-wave modules, etc. and who wish to cooperate with us in the optimization of their design using our LTCC substrate configuration are encouraged to come by our booth and talk to us about our technology and foundry services.