Microwave Journal

Gore Introduces Online Builder for Interconnects

June 23, 2008

W.L. Gore & Associates (Gore) introduces an on-line builder for configuring GORE™ Ultra High Density (UHD) Interconnects to use in Bench Top Test Systems, Instrument Probe Cable, Parallel Data Link, Production Floor Equipment and Automated Test Equipment.

GORE Ultra High Density (UHD) Interconnects provide an integrated system of board mount headers and ganged assemblies with reliable signal integrity performance. Cost savings are achieved through shorter test set-up, fewer calibrations and smaller boards. GORE™ UHD Interconnects enable lower loss, lower skew, better impedance control and shorter board trace lengths.


Gore’s new Ultra High Density Interconnect Builder is available at www.gore.com/uhdbuilder.

GORE Low Loss UHD Cable Assemblies utilize GORE Low Loss Coaxial Cable, made using ePTFE dielectric, with UHD-S, UHD-P and SMA-P connectors. For additional bandwidth, GORE High Frequency UHD Cable Assemblies utilize GORE Ultra-Low Loss Coaxial Cable and precision UHD connectors to achieve performance up to 15 GHz, supporting up to 10 Gigabit data rates.

GORE UHD Cable Assemblies are available as single lines or ganged into two-, four-, or eight-position housings that allow easier handling quick connect and disconnect, and better cable management. A 10 pS relative time match is standard for all ganged UHD Cable Assemblies.