Microwave Journal

Alliance Agrees on Semiconductor Development

July 5, 2007

In a move that signals a firm and ongoing commitment to future technology leadership, IBM and its joint development alliance partners, Infineon Technologies AG and Freescale Semiconductor along with its Common Platform™ technology partners, Chartered Semiconductor Manufacturing and Samsung Electronics, have signed a series of semiconductor process development and manufacturing agreements.


These agreements will now include 32 nm bulk complementary metal oxide semiconductor (CMOS) process technology and joint development of process design kits (PDK) to support that technology. Building on the success of earlier joint development and manufacturing agreements at 90 nm, 65 nm and 45 nm, alliance partners will be able to produce high performance, energy efficient chips at 32 nm.

The partners plan to pool their combined expertise and collaborate to design, develop and manufacture advanced technology through 2010. Those technologies, which are the leading platform for a broad range of systems, may be used by the five partners and other companies to help solve real-life problems in fields such as medicine, communications, transportation and security.