Microwave Journal
www.microwavejournal.com/articles/31028-macom-to-showcase-industry-leading-rfmicrowave-portfolio-at-eumw-2018

MACOM to Showcase Industry-Leading RF/Microwave Portfolio at EuMW 2018

September 11, 2018

MACOM Technology Solutions Inc. will showcase its industry-leading GaN on Si portfolio, Lightwave Antennas and other high performance MMIC and diode products at European Microwave Week (EuMW) 2018, at the IFEMA Feria De Madrid Spain in Madrid, Spain, September 25–27. MACOM’s booth #271 will feature new product solutions optimized for 5G, wireless basestations, radar, test and measurement and industrial, scientific and medical RF applications.

Visit Booth #271 at EuMW to meet with MACOM experts and learn more about:

  • Lightwave Antenna Solutions: Combining RF Coherent Beamforming and Fiber-to-the-Element Optical Transport to deliver wideband performance, low latency and improved spectral efficiency
  • Enabling the Next Generation of Wireless Basestations: Cutting-edge GaN on Si 60 W average power Doherty module
  • Front-End Modules (FEM): Delivering performance and reliability for wireless networking leveraging proprietary switching technology and integration
  • RF Energy: The industry’s first GaN on Si-based RF Energy Toolkit
  • MACOM GaN on Si: GaN on Si technology in mainstream CMOS factories expected to enable the scale capacity, cost structure and supply chain economics for mainstream basestations and RF energy applications at scaled-volume production levels
  • The Trusted Name in High-Performance RF Components: Showcasing MACOM’s high performance MMICs, industry-leading limiter diode design, cross-reference tools and application-specific solutions

Members of MACOM’s product management, engineering and applications teams will be available at Booth #271 to answer any questions. MACOM experts will also be participating in various sessions throughout EuMW, including:

  • Technical Session: Ka-Band P-I-N Diode Based Digital Phase Shifter
    • Presenter: Daniel Kramer
    • Date: Tuesday, September 25
    • Time: 13:30
    • Location: Exhibit Hall
  • Technical Session: Characterization of Bond Wire Interconnects in QFN Packages
    • Presenter: Qun Xiao
    • Date: Tuesday, September 25
    • Time: 13:30
    • Location: Exhibit Hall

Show Information: Exhibition Hall: IFEMA Feria De Madrid Spain

  • Tuesday, September 25: 9:30 AM–6:00 PM
  • Wednesday, September 26: 9:30 AM–5:30 PM
  • Thursday, September 27: 9:30 AM–4:30 PM