Microwave Journal
www.microwavejournal.com/articles/26399-rjr-technologies-announces-shipment-of-over-10-million-acp-packages

RJR Technologies announces shipment of over 10 million ACP packages

May 3, 2016

RJR Technologies, a leading developer of high performance Air Cavity Plastic (ACP) packaging, announced that it has shipped over 10 million ACP packages. As a high volume manufacturer of semiconductor packaging for RF and microwave markets, RJR’s milestone reflects the increasing use of plastic packages in high performance, high frequency RF applications.

“Base station manufacturers in today’s highly competitive wireless infrastructure market are constantly seeking solutions that support higher linearity, higher average output power, and wider operating bandwidths while driving down costs,” said Wil Salhuana, President and CEO of RJR Technologies, Inc. “With our rising volumes of shipments, semiconductor manufacturers clearly recognize that ACP packages offer a compelling combination of high performance, low cost and faster time-to-market over traditional ACC packages.”

Better CTE Matching, Thermal Management

Based on RJR’s Liquid Crystal Polymer (LCP) technology, ACP packages feature an air cavity structure similar to a ceramic package to maximize electrical isolation of the silicon die.  These packages employ an insert-injection molding process that combines a metal alloy lead frame with a LCP sidewall and matching lid with a pre-applied B-staged epoxy. The use of a lower temperature, compliant epoxy makes the package independent of the flange allowing manufacturers to use any of a wide variety of base/flange materials to meet specific CTE matching and thermal management requirements. As a result, ACP is the only packaging technology that allows designers to use lower cost, higher conductivity copper bases.

“By reducing thermal resistance and parasitic effects, our packaging supports higher levels of performance than existing ceramic packages while delivering the low cost and shorter development cycle of a plastic package,” explained Salhuana. “Manufacturers that simply replace ceramic packages featuring an expensive composite-type metal base with our ACP2 with a copper base can reduce the packaging costs of RF power transistors by as much as 50 percent while improving thermal dissipation by 30 percent.”

RJR Technologies has also begun to offer industry-standard QFN packages using its Liquid Crystal Polymer technology. “Our industry standard plastic packages promise to deliver similar benefits over the next few years to system developers in the Gallium Nitride market and in emerging applications such as automotive ignition systems, lighting and consumer microwave appliances,” said Salhuana.

RJR Technologies will display its innovative RF and microwave packaging technology at the IEEE International Microwave Symposium (IMS2016), booth # 2146, from May 22–27 in San Francisco.

For more information, please visit the company’s website at www.rjrtechnologies.com